Methods of sewing components in fabrics using metal wire cloth

Patent metadata

Field	Value
Publication number	US-9872383-B1
Application number	US-201414266636-A
Country	US
Kind code	B1
Filing date	Apr 30, 2014
Priority date	Dec 9, 2013
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

First claim

What is claimed is:

1. An electronics assembly comprising:
a. a fabric;
b. an electronic component comprising a plurality of electrical connection points;
c. a plurality of electrically conductive wire meshes, each wire mesh comprising a plurality of first electrically conductive wires electrically interconnected to form the wire mesh, each electrically conductive wire mesh is coupled to a corresponding one of the plurality of electrical connection points of the electronic component, wherein an electrical connection is formed between each electrically conductive wire mesh and the corresponding one electrical connection point; and
d. a plurality of second electrically conductive wires, each second electrically conductive wire is stitched to the fabric and to a corresponding one of the plurality of electrically conductive wire meshes such that an electrical connection is formed between each second electrically conductive wire and the corresponding one electrically conductive wire mesh.

2. The electronics assembly of claim 1 wherein each electrical connection point comprises a bond pad.

3. The electronics assembly of claim 1 wherein each electrical connection point comprises a solder bump.

4. The electronics assembly of claim 1 wherein each electrical connection point is coupled to the corresponding one electrically conductive wire mesh via a solder joint, a welded joint or an electrically conductive adhesive.

5. The electronics assembly of claim 1 wherein each electrically conductive wire mesh is coupled to the fabric using an adhesive.

6. The electronics assembly of claim 1 wherein each electrically conductive wire mesh is coupled to the fabric using a stitched non-electrically conductive thread.

7. The electronics assembly of claim 1 wherein each electrically conductive wire mesh is coupled to the fabric using a second electrically conductive thread stitched to the fabric and to the electrically conductive wire mesh.

8. The electronics assembly of claim 1 wherein the plurality of first electrically conductive wires of each electrically conductive wire mesh are mechanically and electrically interconnected.

9. The electronics assembly of claim 8 wherein each of the plurality of first electrically conductive wires comprise a metal wire made of one or more of copper, silver, nickel and their alloys.

10. The electronics assembly of claim 8 wherein each of the plurality of first electrically conductive wires comprise an electrically conductive plating finish.

11. The electronics assembly of claim 1 wherein the plurality of first conductive wires of each electrically conductive wire mesh are interconnected to form a single electrical conductor.

12. The electronics assembly of claim 1 further comprising an encapsulation layer coupled to the electronics component, the plurality of electrically conductive wire mesh and the plurality of second electrically conductive wires.

13. The electronics assembly of claim 1 wherein the fabric comprises an insulated wire including an inner metal wire and an outer insulation layer, further wherein one of the plurality of second electrically conductive wires is electrically coupled to the inner metal wire of the insulated wire.

14. The electronics assembly of claim 1 wherein each second electrically conductive wire stitched to the fabric comprises two separate wires, wherein the two separate wires comprise a metal wire and an insulation wire.

15. The electronics assembly of claim 1 wherein the electronics assembly is wearable.

16. The electronics assembly of claim 1 wherein the plurality of first electrically conductive wires for each electrically conductive wire mesh form a crosshatch pattern.

17. The electronics assembly of claim 1 wherein each electrically conductive wire mesh is physically separated and distinct from each other electrically conductive wire mesh in the plurality of electrically conductive wires meshes.

Assignees

• Flextronics Ap Llc

Inventors

• Liu Weifeng
• Mohammed Anwar
• Feng Zhen

Classifications

• H01R43/0235

  for applying solder (H01R43/0228 takes precedence) · CPC title

• D05B17/00

  Sewing machines for concurrently making thread and welded seams (for making non-welded fluid-tight seams D05B1/26) · CPC title

• H01R4/00

  Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H01R4/02

  Soldered or welded connections {(H01R4/625, H01R4/723, H01R12/59 take precedence)} · CPC title