Electronic Device Having Structured Flexible Substrates With Bends

Patent metadata

Field	Value
Publication number	US-2016105950-A1
Application number	US-201414512073-A
Country	US
Kind code	A1
Filing date	Oct 10, 2014
Priority date	Oct 10, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

A flexible substrate may be provided with an array of holes and conductive traces that extend along the flexible substrate between the holes. The flexible substrate may form part of a display or other component in an electronic device. The conductive traces may be metal traces that have meandering path shapes to resist damage upon bending. A polymer coating may be applied over the metal traces to align a neutral stress plane with the metal traces and to serve as a moisture barrier. The holes may allow the flexible substrate to twist and form a three-dimensional shape as the flexible substrate is bent. A rigid or flexible protective coating may be formed by depositing a liquid polymer precursor on the flexible substrate and curing the liquid polymer precursor.

First claim

What is claimed is:

1 . Apparatus, comprising:
a flexible substrate layer having holes and a bend; and conductive traces on the flexible substrate, wherein the holes are formed between the conductive traces and wherein the flexible substrate has a three-dimensional shape formed by twisting portions of the flexible substrate layer that overlap the bend.

2 . The apparatus defined in claim 1 wherein the conductive traces comprise metal traces.

3 . The apparatus defined in claim 2 wherein the metal traces comprise meandering traces.

4 . The apparatus defined in claim 3 wherein the metal traces extend along a longitudinal axis and wherein the bend is formed around a bend axis that is perpendicular to the longitudinal axis.

5 . The apparatus defined in claim 4 wherein the metal traces are formed in sets each of which includes multiple metal traces that are not separated from each other by any holes.

6 . The apparatus defined in claim 4 wherein the holes are through holes that pass between first and second opposing surfaces of the flexible substrate layer.

7 . The apparatus defined in claim 4 wherein the holes are formed only partway through the flexible substrate layer.

8 . The apparatus defined in claim 4 further comprising a polymer coating over the metal traces that aligns a neutral stress plane with the metal traces and that serves as a moisture barrier for the metal traces.

9 . The apparatus defined in claim 4 wherein the metal traces have serpentine paths with curved segments.

10 . The apparatus defined in claim 4 wherein the metal traces have temple gate paths.

11 . The apparatus defined in claim 4 wherein the metal traces have zigzag paths.

12 . The apparatus defined in claim 4 wherein the holes are circular.

13 . The apparatus defined in claim 4 wherein the holes are formed from slits in the flexible substrate layer.

14 . The apparatus defined in claim 4 wherein the holes are slots.

15 . The apparatus defined in claim 4 wherein the holes have straight and curved edges.

16 . Apparatus, comprising:
a flexible substrate layer having holes and a bend; and conductive traces on the flexible substrate, wherein the holes are formed between the conductive traces and wherein the flexible substrate has a portion that twists to form a three-dimensional shape overlapping the bend.

17 . The apparatus defined in claim 16 further comprising an array of light-emitting pixels on the flexible substrate in a portion of the flexible substrate that does not overlap the bend.

18 . The apparatus defined in claim 17 wherein the conductive traces comprise meandering metal traces that overlap the bend.

19 . The apparatus defined in claim 18 wherein the holes comprise an array of through holes and wherein the metal traces run along portions of the flexible printed circuit between the holes.

20 . A method, comprising:
forming a flexible polymer substrate that has an array of openings and meandering conductive traces between the openings; bending the flexible polymer substrate to form a bend, wherein bending the flexible polymer substrate cause the flexible polymer substrate to twist and form a three-dimensional shape overlapping the bend.

21 . The method defined in claim 20 further comprising:
forming a protective polymer coating on the flexible polymer substrate overlapping the bend.

22 . The method defined in claim 21 wherein forming the protective polymer coating comprises:
applying a liquid polymer precursor to the flexible polymer substrate after bending the flexible polymer substrate; and
curing the liquid polymer precursor to form the protective polymer coating.

23 . The method defined in claim 21 wherein forming the protective polymer coating comprises:
stretching the flexible polymer substrate before bending the flexible polymer substrate;
applying a liquid polymer precursor to the stretched flexible polymer substrate before bending the flexible polymer substrate; and
curing the liquid polymer precursor to form the protective polymer coating before bending the flexible polymer substrate.

24 . The method defined in claim 21 wherein forming the protective polymer coating comprises:
applying a liquid polymer precursor to the flexible polymer substrate before bending the flexible polymer substrate; and
curing the liquid polymer precursor to form the protective polymer coating after bending the flexible polymer substrate.

Assignees

• Apple Inc

Inventors

• Drzaic Paul S
• Zhang Zhen

Classifications

• B05D3/002

  Pretreatement · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• B29C53/04

  of plates or sheets {(B29C63/04 takes precedence; bending or folding paper B31F1/0003; folding films B65H45/00)} · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title