Diamond abrasive recovery method

US9868187B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9868187-B2
Application numberUS-201414786895-A
CountryUS
Kind codeB2
Filing dateApr 16, 2014
Priority dateApr 30, 2013
Publication dateJan 16, 2018
Grant dateJan 16, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium; and (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium.

First claim

Opening claim text (preview).

The invention claimed is: 1. A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon, the method comprising: (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium; and (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium. 2. The diamond abrasive recovery method according to claim 1 , wherein, the inorganic salt including the metallic element which is to be a divalent or trivalent cation used in the separating is magnesium salt, calcium salt, or aluminum salt. 3. The diamond abrasive recovery method according to claim 1 , wherein, the low polarity dispersion medium is toluene or diethyl ether. 4. The diamond abrasive recovery method according to claim 1 , wherein, the recovery method of polishing material in the separating is a decantation separating method by natural sediment.

Assignees

Inventors

Classifications

  • using flocculating agents (for purifying water C02F1/52; for liquid radioactive waste G21F9/10) · CPC title

  • by flocculation or precipitation of suspended impurities {(C02F1/463 takes precedence)} · CPC title

  • B24B55/12Primary

    Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9868187B2 cover?
A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation…
Who is the assignee on this patent?
Konica Minolta Inc
What technology area does this patent fall under?
Primary CPC classification B24B55/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).