Reinforcing member for flexible printed wiring board flexible printed wiring board, and shield printed wiring board

Patent metadata

Field	Value
Publication number	US-9867280-B2
Application number	US-201615227398-A
Country	US
Kind code	B2
Filing date	Aug 3, 2016
Priority date	Feb 26, 2013
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.

First claim

The invention claimed is:

1. A shield printed wiring board comprising a printed wiring board including an insulating film;
a shield film including an insulating layer provided on the insulating film of the printed wiring board and a conductive layer formed below the insulating layer; and
a reinforcing member for a flexible printed wiring board, which includes one surface provided on the insulating layer of the shield film opposing a mounting position of an electronic component and the other surface in electrical conduction with an external ground member, the reinforcing member including:
a metal base which is conductive; and
a surface layer which is formed on a surface of the metal base to constitute at least a part of the other surface,
the surface layer having higher conductivity and corrosion resistance than the metal base,
the surface layer being 0.004 to 0.2 μm thick, and
the reinforcing member being adhered to the insulating layer of the shield film at the one surface by a conductive adhesive formed on the one surface of the reinforcing member, as conductive particles included in the conductive adhesive penetrate the insulating layer of the shield film and are in contact with the conductive layer.

2. The shield printed wiring board according to claim 1 , wherein, the surface layer is formed of alloy which is made of noble metal or is mainly made of noble metal.

3. The shield printed wiring board according to claim 2 , wherein, the noble metal is gold or palladium.

4. The shield printed wiring board according to claim 1 , wherein, the metal base is formed of stainless steel.

5. The shield printed wiring board according to claim 1 , further comprising a conductive composition layer which is provided on the one surface side of the metal base.

6. The shield printed wiring board according to claim 1 , wherein, the surface layer is formed not only on the other surface side but also on the one surface side of the metal base.

7. The shield printed wiring board according to claim 1 , wherein, the surface layer is an assembly of lines and/or dots.

Assignees

• Tatsuta Electric Wire & Cable Co Ltd
• Tatsuta Electric Wire And Cable Co Ltd

Inventors

• Watanabe Masahiro
• Tajima Hiroshi

Classifications

• H05K2201/1028

  Thin metal strips as connectors or conductors · CPC title

• H05K1/0281

  Reinforcement details thereof · CPC title

• H05K1/0215

  Grounding of printed circuits by connection to external grounding means · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K3/321

  by conductive adhesives · CPC title