Thin-film photoelectric conversion device and method for manufacturing same

US9865762B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9865762-B2
Application numberUS-201314430540-A
CountryUS
Kind codeB2
Filing dateSep 27, 2013
Priority dateSep 28, 2012
Publication dateJan 9, 2018
Grant dateJan 9, 2018

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Abstract

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The thin-film photoelectric conversion device of the present invention includes: a transparent electroconductive film having zinc oxide as a main component; a contact layer; a photoelectric conversion unit having a p-type semiconductor layer, an i-type semiconductor layer and an n-type semiconductor layer in this order; and a back electrode layer, in this order, on one main surface of a substrate. The contact layer has an intrinsic crystalline semiconductor layer and a p-type crystalline semiconductor layer in this order from the substrate side, and the intrinsic crystalline semiconductor layer of the contact layer and the transparent electroconductive film are in contact with each other. The p-type crystalline semiconductor layer of the contact layer is preferably a layer having as a main component a silicon alloy selected from the group consisting of a silicon oxide; a silicon nitride; and silicon carbide.

First claim

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The invention claimed is: 1. A thin-film photoelectric conversion device comprising: a transparent electroconductive film having zinc oxide as a main component; a contact layer; a photoelectric conversion unit having a p-type semiconductor layer, an i-type semiconductor layer and an n-type semiconductor layer in this order; and a back electrode layer, in this order, on one main surface of a substrate, wherein the contact layer includes an intrinsic crystalline silicon semiconductor layer and a p-type crystalline semiconductor layer in this order from the substrate side, the p-type crystalline semiconductor layer of the contact layer is a layer having as a main component a silicon alloy selected from the group consisting of a silicon oxide; a silicon nitride; silicon carbide; and silicon germanium, and the intrinsic crystalline silicon semiconductor layer of the contact layer and the transparent electroconductive film are in contact with each other, wherein the p-type semiconductor layer of the photoelectric conversion unit and the p-type crystalline semiconductor layer of the contact layer are separate layers. 2. The thin-film photoelectric conversion device according to claim 1 , wherein the p-type crystalline semiconductor layer of the contact layer is a layer having a silicon oxide as a main component. 3. The thin-film photoelectric conversion device according to claim 1 , wherein the substrate comprises a transparent insulating base and an underlying layer, the underlying layer is formed on the transparent electroconductive film side of the transparent insulating base, the underlying layer includes an irregular structure on a surface on the transparent electroconductive film side, and the irregular structure has a top-bottom distance of 100 to 1000 nm, and a projection peak-to-peak distance of 200 to 2000 nm. 4. The thin-film photoelectric conversion device according to claim 1 , wherein the intrinsic crystalline silicon semiconductor layer of the contact layer has a thickness of 0.2 to 5 nm. 5. The thin-film photoelectric conversion device according to claim 1 , wherein the p-type crystalline semiconductor layer of the contact layer has a thickness of 3 to 15 nm. 6. The thin-film photoelectric conversion device according to claim 1 , wherein the p-type crystalline semiconductor layer of the contact layer has a dark conductivity of 10 −8 to 10 −1 S/cm, and a refractive index of 1.7 to 3.0 to light having a wavelength of 600 nm. 7. The thin-film photoelectric conversion device according to claim 1 , wherein the p-type semiconductor layer of the photoelectric conversion unit is a p-type amorphous silicon carbide layer. 8. The thin-film photoelectric conversion device according to claim 1 , further comprising, between the photoelectric conversion unit and the back electrode layer, another photoelectric conversion unit. 9. A solar cell module comprising the thin-film photoelectric conversion device according to claim 1 . 10. A method of manufacturing a thin-film photoelectric conversion device comprising: forming on one main surface of a substrate a transparent electroconductive film having zinc oxide as a main component; forming an intrinsic crystalline silicon semiconductor layer and a p-type crystalline semiconductor layer in this order on the transparent electroconductive film to form a contact layer; forming a p-type semiconductor layer, an i-type semiconductor layer and an n-type semiconductor layer in this order on the contact layer to form a photoelectric conversion unit; and forming a back electrode layer, wherein the p-type semiconductor layer of the photoelectric conversion unit and the p-type crystalline semiconductor layer of the contact layer are separate layers, the intrinsic crystalline silicon semiconductor layer of the contact layer and the transparent electroconductive film are in contact with each other, the p-type crystalline semiconductor layer of the contact layer is a layer having as a main component a silicon alloy selected from the group consisting of a silicon oxide; a silicon nitride; silicon carbide; and silicon germanium, and the intrinsic crystalline silicon semiconductor layer and the p-type crystalline semiconductor layer of the contact layer are formed by a plasma-enhanced CVD method. 11. The method of manufacturing the thin-film photoelectric conversion device according to claim 10 , wherein after formation of the transparent electroconductive film having zinc oxide as a main component, a surface thereof is subjected to an etching treatment in the step of forming the transparent electroconductive film. 12. The method of manufacturing the thin-film photoelectric conversion device according to claim 11 , wherein the etching treatment is plasma etching.

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What does patent US9865762B2 cover?
The thin-film photoelectric conversion device of the present invention includes: a transparent electroconductive film having zinc oxide as a main component; a contact layer; a photoelectric conversion unit having a p-type semiconductor layer, an i-type semiconductor layer and an n-type semiconductor layer in this order; and a back electrode layer, in this order, on one main surface of a substra…
Who is the assignee on this patent?
Kaneka Corp
What technology area does this patent fall under?
Primary CPC classification H01L31/077. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).