Laser ashing of polyimide for semiconductor manufacturing

Patent metadata

Field	Value
Publication number	US-9865564-B2
Application number	US-201514624601-A
Country	US
Kind code	B2
Filing date	Feb 18, 2015
Priority date	Nov 5, 2010
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.

First claim

The invention claimed is:

1. A system for laser ashing of polyimide for a semiconductor manufacturing process, the system comprising:
a semiconductor chip;
a top chip attached to the semiconductor chip by a connection layer;
a supporting material;
a polyimide glue layer disposed between the supporting material and semiconductor chip;
a plasma asher; and
an ashing laser configured to ash the polyimide glue on the semiconductor chip, wherein the ashing laser is configured to release the supporting material from the semiconductor chip.

2. The system of claim 1 , wherein the ashing laser comprises and ultraviolet (UV) laser.

3. The system of claim 1 , further comprising a fume extraction device configured to remove polyimide fumes formed during ashing of the polyimide glue from the system for laser ashing of polyimide.

4. The system of claim 1 , further comprising a debris shield located between the ashing laser and the polyimide glue, the debris shield comprising a material that is transparent in a wavelength of the ashing laser.

5. The system of claim 1 , wherein the polyimide is on the semiconductor chip, wherein the system is operated so that prior to activation of the ashing laser to ash polyimide glue on the semiconductor chip, the plasma asher is activated to clean carbon debris that may be present on the polyimide glue, wherein the system is operated so that the plasma asher performs plasma ashing for a time of less than about one hour.

6. The system of claim 1 , wherein the plasma asher is configured to perform plasma ashing using 600 millitor (mTorr) O 2 plasma at 1000 watts (W).

7. The system of claim 1 , wherein the ashing laser has a fluence from about 100 millijoules per centimeter squared (mJ/cm 2 ) to about 300 mJ/cm 2 .

8. The system of claim 1 , wherein the ashing laser has a laser repetition rate of about 200 hertz (Hz).

9. The system of claim 1 , wherein the system is operated to perform plasma cleaning using the plasma asher to remove carbon debris from the polyimide glue before ashing the polyimide glue using the ashing laser.

10. The system of claim 1 , wherein the system is operated so that the plasma asher is operated to clean carbon debris that may be present on the polyimide glue, and wherein the system is operated so that prior to the plasma asher being operated to clean carbon debris that may be present on the polyimide glue, the ashing laser is operated to release the supporting material from the semiconductor chip.

11. The system of claim 1 , wherein the ashing laser is operated to remove polyimide glue from a top surface of the semiconductor chip.

12. The system of claim 1 , wherein the system is operated so that the plasma asher is operated to clean carbon debris that may be present on the polyimide glue, and wherein the system is operated so that prior to the plasma asher being operated to clean carbon debris that may be present on the polyimide glue, the ashing laser is operated to release the supporting material from the semiconductor chip, and wherein the ashing laser is operated to fully ablate the polyimide glue from the semiconductor chip.

13. The system of claim 1 , wherein the system is configured to clean carbon debris present on the polyimide glue using the plasma asher, wherein the system is configured to release the supporting material from the semiconductor chip using the ashing laser, and wherein the system is configured to perform the release using the ashing laser prior to performing the clean using the plasma asher.

14. The system of claim 1 , wherein the ashing laser is configured to fully ablate the polyimide glue from the semiconductor chip.

15. The system of claim 1 , wherein the ashing laser is configured to remove polyimide glue from a top surface of the semiconductor chip.

16. The system of claim 1 , wherein the system is configured to clean carbon debris present on the polyimide glue using the plasma asher, wherein the system is configured to release the supporting material from the semiconductor chip using the ashing laser, and wherein the system is configured to perform the release using the ashing laser prior to performing the clean using the plasma asher, and wherein the system is configured to fully ablate the polyimide glue from the semiconductor chip using the ashing laser.

17. The system of claim 1 , wherein the ashing laser is configured to make multiple passes across the polyimide glue layer for performing full ablation of the polyimide glue layer.

18. A system for laser ashing of polyimide for a semiconductor manufacturing process, the system comprising:
a semiconductor chip;
a top chip attached to the semiconductor chip by a connection layer;
a supporting material;
a polyimide glue layer disposed between the supporting material and semiconductor chip;
a plasma asher; and
an ashing laser configured to ash the polyimide glue on the semiconductor chip, wherein the ashing laser is configured to fully ablate the polyimide glue from the semiconductor chip.

19. The system of claim 18 , wherein the ashing laser is configured to release the supporting material from the semiconductor chip.

20. A system for laser ashing of polyimide for a semiconductor manufacturing process, the system comprising:
a semiconductor chip;
a top chip attached to the semiconductor chip by a connection layer;
a supporting material;
a polyimide glue layer disposed between the supporting material and semiconductor chip;
a plasma asher; and
an ashing laser configured to ash the polyimide glue on the semiconductor chip, wherein the ashing laser is configured to make multiple passes across the polyimide glue layer for performing full ablation of the polyimide glue layer.

Assignees

• Globalfoundries Inc
• Globalfoundries Inc

Inventors

• Cadotte Maxime
• Guerin Luc
• Truong Van Thanh
• Whitehead Steve

Classifications

• H10P70/30

  Cleaning after the substrates have been singulated · CPC title

• H10P50/286

  of organic materials · CPC title

• H10W72/013

  of die-attach connectors · CPC title

• H10W72/0711 Primary

  Apparatus therefor · CPC title

• H01L2924/01079

  Electricity · mapped topic