Molded body and electrical device having a molded body for high voltage applications

Patent metadata

Field	Value
Publication number	US-9865532-B2
Application number	US-201615229556-A
Country	US
Kind code	B2
Filing date	Aug 5, 2016
Priority date	Aug 7, 2015
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

An electrical device comprising a ribbed molded body housing an electrical component is provided. The ribbed molded body includes at least one surface or portion having a plurality of ribs along at least a portion of the surface. The electrical component may be a passive or active electrical component. The electrical component may be connected to a lead frame and molded into the ribbed molded body.

First claim

What is claimed is:

1. An electrical device for high voltage applications, comprising:
an electrical component connected to a first lead and a second lead;
an insulative molded body formed around the electrical component and portions of the first lead and the second lead, the molded body comprising a top surface, opposite bottom surface, front surface, opposite back surface, left side surface and opposite right side surface;
the first lead extending from the right side surface of the molded body, and the second lead extending from the left side surface of the molded body;
wherein at least a portion of the front surface, bottom surface and back surface of the molded body between the first lead and the second lead comprise a plurality ribs, and wherein at least one or more of the ribs extends contiguously along the front surface, bottom surface and back surface.

2. The electrical device of claim 1 , wherein each of the ribs has sloping sidewalls.

3. The electrical device of claim 1 , further comprising a third lead connected to the same side of the electrical component as the second lead.

4. The electrical device of claim 3 , wherein the front surface comprises non-ribbed portions, wherein the non-ribbed portions lie in a plane, and wherein the ribs of the front surface do not extend beyond the plane.

5. The electrical device of claim 4 , wherein the back surface comprises non-ribbed portions, wherein the non-ribbed portions lie in a plane, and wherein the ribs of the back surface do not extend beyond the plane.

6. The electrical device of claim 1 , wherein the front surface comprises a non-ribbed portion extending along a length of the front surface, and wherein the ribbed portion of the front surface extends along a length that is greater than the length of the non-ribbed portion.

7. The electrical device of claim 6 , wherein the back surface comprises a non-ribbed portion extending along a length of the back surface, and wherein the ribbed portion of the back surface extends along a length that is greater than the length of the non-ribbed portion.

8. The electrical device of claim 1 , wherein the top surface is generally flat.

9. The electrical device of claim 1 , wherein the electrical device is a passive component or an active component.

10. The electrical device of claim 9 , wherein the electrical device is a passive component comprising a resistor, an inductor, a capacitor or a chip divider.

11. The electrical device of claim 9 , wherein the electrical device is an active component comprising a diode, semiconductor, rectifier, transistor, or integrated circuit.

12. The electrical device of claim 1 , wherein the leads are turned along the first and second side surfaces and along at least portions of the bottom of the device to form a surface mount device.

13. The electrical device of claim 1 , wherein the molded body includes a first surface mount portion adjacent the right side surface, and a second surface mount portion adjacent the left side surface, and wherein the first and second surface mount portions do not include ribs.

14. The electrical device of claim 1 , wherein the electrical component is mounted on a lead frame comprising at least a first lead and a second lead.

15. The electrical device of claim 14 , wherein the molded body encases the electrical component and lead frame, leaving at least portions of the leads exposed.

16. The electrical device of claim 1 , wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.

17. The electrical device of claim 1 , wherein the electrical component has at least two leads.

18. The electrical device of claim 1 , further comprising steps formed in the molded body adjacent at least at least two adjacent ribs.

19. A method of making an electrical device for high voltage applications, comprising the steps of:
connecting an electrical component to a lead frame comprising at least two leads;
molding an insulative ribbed molded body around the electrical component and portions of the lead frame, leaving portions of the at least two leads exposed, the ribbed molded body including a top surface, opposite bottom surface, front surface, opposite back surface, left side surface and opposite right side surface, each of the front surface, bottom surface and back surface comprising a portion including a plurality ribs, and wherein at least one or more of the ribs extend contiguously along the front surface, bottom surface, and back surface; and
forming the ends of the leads around the ribbed molded body.

20. The method of claim 19 , further comprising the step of marking a portion of the ribbed molded body.

21. The method of claim 20 , further comprising the step of trimming the lead frame.

22. The method of claim 21 , further comprising the step of testing the device.

23. The method of claim 22 , wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.

24. A method of making an electrical device for high voltage applications, comprising the steps of:
connecting an electrical component to a lead frame comprising at least two leads;
applying a moisture barrier to a portion of the electrical component prior to molding the ribbed molded body around the electrical component;
molding an insulative ribbed molded body comprising at least a ribbed portion around the electrical component and portions of the lead frame, leaving portions of the at least two leads exposed; and
forming the ends of the leads around the ribbed molded body.

25. The method of claim 24 , further comprising the step of marking a portion of the ribbed molded body.

26. The method of claim 25 , further comprising the step of trimming the lead frame.

27. The method of claim 26 , further comprising the step of testing the device.

28. The method of claim 27 , wherein the ribbed molded body comprises a material having a comparative tracking index (CTI) of 600V.

Assignees

• Vishay Dale Electronics Llc

Inventors

• Glenn Darin
• Blackburn Scott

Classifications

• H10W74/111 Primary

  the semiconductor body being completely enclosed · CPC title

• H10W70/481

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W42/60

  protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title

• H10W90/811

  Multiple chips on leadframes · CPC title