Displaceable insulation barrier

Patent metadata

Field	Value
Publication number	US-9601850-B2
Application number	US-201314388594-A
Country	US
Kind code	B2
Filing date	Mar 22, 2013
Priority date	Mar 26, 2012
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board ( 2 ), said arrangement comprising the printed circuit board ( 2 ) and an insulation barrier ( 3 ), wherein the printed circuit board ( 2 ) has an opening ( 7 ) between the electric potentials, and the insulation barrier ( 3 ) is disposed on the printed circuit board ( 2 ) so as to be displaceble through the opening ( 7 ) and is designed such that the isolating distance between the two electric potentials can be enlarged by displacing the insulation barrier ( 3 ) relative to the printed circuit board ( 2 ). The arrangement makes it possible obtain a high packing density on the printed circuit board ( 2 ).

First claim

The invention claimed is:

1. An arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board, said arrangement comprising:
the printed circuit board, and
an insulation barrier, wherein the insulation barrier is designed as a slide element;
wherein the printed circuit board has an opening between the electric potentials, and the insulation barrier is disposed on the printed circuit board so as to be displaceable through the opening and is designed such than an isolating distance between the two electric potentials can be enlarged by displacing the insulation barrier relative to the printed circuit board;
wherein the insulation barrier is shaped and arranged to be fixed in a first state in which said insulation barrier has not been slid through the opening and/or is shaped and arranged to be fixed in a second state relative to the printed circuit board, in which said insulation barrier has been slid through the opening.

2. The arrangement according to claim 1 , comprising at least two electrical components, wherein the electrical components are electrically connected to the printed circuit board by terminations, the insulation barrier is displaceably disposed on one of the electrical components such that, in the state in which the insulation barrier has been slid through the opening, the isolating distance between at least one termination of at least one component and at least one termination of at least one other component is enlarged.

3. The arrangement according to claim 2 , wherein the terminations that electrically connect the electrical components to the printed circuit board comprise solder terminals.

4. The arrangement according to claim 2 , wherein the insulation barrier is disposed and designed such that, in the displaced state of the insulation barrier, the isolating distance is enlarged between all terminations of at least one component and all terminations of at least one other component.

5. The arrangement according to claim 2 , wherein the insulation barrier is designed as a slide element.

6. The arrangement according to claim 5 , wherein the insulation barrier is made of plastic.

7. The arrangement according to claim 2 , wherein the component and/or the insulation barrier are designed such that the insulation barrier is arranged to be detachably secured on the component.

8. The arrangement according to claim 2 , wherein the slide element and the electrical component, on which the slide element is disposed, internet via a dovetail guide.

9. The arrangement according to claim 2 , wherein the insulation barrier is displaceable perpendicularly to an extension of the printed circuit board.

10. The arrangement according to claim 2 , wherein the insulation barrier can be fixed in a first state in which said insulation barrier has not been slid through the opening and/or can be fixed in a second state relative to the printed circuit board, in which said insulation barrier has been slid through the opening.

11. The arrangement according to claim 1 , wherein the insulation barrier is disposed and designed such that, in a displaced state of the insulation barrier, the isolating distance is enlarged between all terminations of at least one component and all terminations of at least one other component.

12. The arrangement according to claim 1 , wherein the component and/or the insulation barrier are designed such that the insulation barrier is arranged to be detachably secured on the component.

13. The arrangement according to claim 1 , wherein the slide element and the electrical component, on which the slide element is disposed, interact via a dovetail guide.

14. The arrangement according to claim 1 , wherein the insulation barrier is displaceable perpendicularly to an extension of the printed circuit board.

15. A built-in housing for installation on a supporting rail, comprising an arrangement according to claim 1 , which is disposed within the housing.

16. The built-in housing according to claim 15 , wherein the displaceable insulation barrier is held, fixed in position, between housing walls of the housing.

17. The arrangement according to claim 1 , wherein the insulation barrier is made of a plastic.

18. A method for increasing the insulation coordination between at least two electric potentials on a printed circuit board, said arrangement comprising the printed circuit board and an insulation barrier, wherein the printed circuit board has an opening between the electric potentials, the method comprising:
displacing the insulation barrier from a first position, in which the insulation barrier has not been slid through the opening, into a second position, in which the insulation barrier has been slid through the opening.

19. An arrangement for increasing the insulation coordination between at least two nodes with electric potentials on a printed circuit board, said arrangement comprising:
the printed circuit board;
an insulation barrier; and
at least two electric components, wherein the electrical components are fixed to the printed circuit board, and electrically connected to the printed circuit board via terminations;
wherein the printed circuit board has an opening between the electric potentials, and the insulation barrier is disposed on the printed circuit board so as to be displaceable through the opening and is designed such than isolation between the two electric potentials can be increased by displacing the insulation barrier relative to the printed circuit board.

20. The arrangement of claim 19 wherein the insulation barrier is displaceably disposed on one of the electrical components such that, in a first state in which the insulation barrier has been slid through the opening, the isolating distance between a first termination of a first electrical component and a second termination of a second electrical component is increased; and
wherein the insulation barrier is shaped and arranged to be fixed in the first state relative to the printed circuit board, in which said insulation barrier has been slid through the opening, and shaped and arranged in a second state in which said insulation barrier has not been slid through the opening.

Assignees

• Phoenix Contact Gmbh & Co

Inventors

• Best Frank
• Seelig Marco

Classifications

• H01R9/26

  Clip-on terminal blocks for side-by-side rail- or strip-mounting · CPC title

• Y10T29/49124

  On flat or curved insulated base, e.g., printed circuit, etc. · CPC title

• H05K3/0011

  Working of insulating substrates or insulating layers · CPC title

• H05K7/1469

  Terminal blocks for connecting sensors · CPC title

• H05K1/0256 Primary

  Electrical insulation details, e.g. around high voltage areas · CPC title