Substrate liquid processing method, substrate liquid processing apparatus, and recording medium

Patent metadata

Field	Value
Publication number	US-9865483-B2
Application number	US-201514851388-A
Country	US
Kind code	B2
Filing date	Sep 11, 2015
Priority date	Sep 25, 2014
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

Disclosed is a substrate liquid processing method. The method includes: supplying a first processing liquid to a central portion of a substrate at a first flow rate by a first nozzle while rotating the substrate using a substrate holding unit; supplying a second processing liquid to a location between the central portion and an outer circumferential end of the substrate by a second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate; and changing the flow rate of the first processing liquid supplied from the first nozzle to a second flow rate lower than the first flow rate, so as to continue forming of the liquid film on the overall surface of the substrate while supplying the second processing liquid by the second nozzle to the substrate that is formed with a liquid film on the overall surface thereof.

First claim

What is claimed is:

1. A substrate liquid-processing apparatus comprising:
a substrate holding unit configured to horizontally hold a substrate and to rotate the substrate around a vertical axis;
a first nozzle including a pipe which supplies a first processing liquid to a central portion of the substrate held by the substrate holding unit;
a second nozzle including a pipe which supplies a second processing liquid to a location between the central portion and a circumferential end of the substrate; and
a controller configured to control supply initiation and stop of the first processing liquid from the first nozzle and the supply initiation and stop of the second processing liquid from the second nozzle,
wherein the controller is configured to execute the supply of the first processing liquid from the first nozzle to the central portion of the rotating substrate at a first flow rate and the supply of the second processing liquid from the second nozzle, and to execute change of a supply flow rate of the first processing liquid, from the first nozzle to the central portion of the substrate, into a second flow rate that is lower than the first flow rate while supplying the second processing liquid to the substrate that is formed with a liquid film on the overall surface thereof, and
the sum of the second flow rate and a supply flow rate of the second processing liquid is less than the first flow rate.

2. The apparatus according to claim 1 , wherein the first processing liquid is supplied to the central portion of the substrate at the first flow rate in a range of about 2.0 L/min to about 2.5 L/min while the substrate is rotated at a rotation speed in a range of about 500 rpm to about 1500 rpm such that the liquid film is formed on the overall surface of the substrate in a state where the second processing liquid is not supplied, and
the first processing liquid is supplied to the central portion of the substrate at the second flow rate in a range of about 1.0 L/min to about 1.5 L/min while the substrate is rotated at a rotation speed in a range of about 500 rpm to about 1500 rpm such that the liquid film is not formed on the overall surface of the substrate in a state where the second processing liquid is not supplied.

3. The apparatus according to claim 2 , wherein the supply position of the second processing liquid at a time of supplying the second processing liquid to the location between the central portion and the outer circumferential end of the substrate by the second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate is a position that causes the second processing liquid to cover an outer circumferential end of the liquid film formed when the first processing liquid is supplied to the substrate at the second flow rate and the second processing liquid is not supplied to the substrate.

4. The apparatus according to claim 1 , wherein the second processing liquid is a liquid mixable with the first processing liquid.

5. The apparatus according to claim 4 , wherein the first processing liquid and the second processing liquid are pure water.

6. The apparatus according to claim 1 , wherein the second processing liquid has a surface tension than that of the first processing liquid.

7. The apparatus according to claim 4 , wherein the first processing liquid is pure water, and the second processing liquid is isopropyl alcohol.

8. The apparatus according to claim 1 , wherein the second nozzle ejects the second processing liquid along a tangential direction of a rotation circle from an upstream side toward a downstream side of a rotation circle, the rotation circle rotating around the vertical axis in the same direction as the substrate, and the second nozzle is disposed such that an angle between the ejecting direction and the surface of the substrate is within a range of 5° to 15° when viewed from a lateral side.

9. The apparatus according to claim 8 , wherein the second nozzle ejects the second processing liquid outwardly in a radial direction of the rotation circle and is supplied to the substrate such that an angle between the supply direction of the second processing liquid and the tangential direction is within a range of 0° to 45° when viewed from an upper side.

10. A substrate liquid-processing apparatus comprising:
a substrate holding unit configured to horizontally hold a substrate and to rotate the substrate around a vertical axis;
a first nozzle including a pipe which supplies a first processing liquid being pure water to a central portion of the substrate held by the substrate holding unit;
a second nozzle including a pipe which supplies a second processing liquid being isopropyl alcohol to a location between the central portion and a circumferential end of the substrate; and
a controller configured to control supply initiation and stop of the first processing liquid from the first nozzle and the supply initiation and stop of the second processing liquid from the second nozzle,
wherein the controller is configured to execute the supply of the first processing liquid from the first nozzle to the central portion of the rotating substrate at a first flow rate and the supply of the second processing liquid from the second nozzle, and to execute change of a supply flow rate of the first processing liquid, from the first nozzle to the central portion of the substrate, into a second flow rate that is lower than the first flow rate while supplying the second processing liquid to the substrate that is formed with a liquid film on the overall surface thereof, and
the first processing liquid is pure water, and the second processing liquid is isopropyl alcohol.

11. A substrate liquid-processing apparatus comprising:
a substrate holding unit configured to horizontally hold a substrate and to rotate the substrate around a vertical axis;
a first nozzle including a pipe which supplies a first processing liquid to a central portion of the substrate held by the substrate holding unit;
a second nozzle including a pipe which supplies a second processing liquid to a location between the central portion and a circumferential end of the substrate; and
a controller configured to control supply initiation and stop of the first processing liquid from the first nozzle and the supply initiation and stop of the second processing liquid from the second nozzle,
wherein the controller is configured to execute the supply of the first processing liquid from the first nozzle to the central portion of the rotating substrate at a first flow rate and the supply of the second processing liquid from the second nozzle, and to execute change of a supply flow rate of the first processing liquid, from the first nozzle to the central portion of the substrate, into a second flow rate that is lower than the first flow rate while supplying the second processing liquid to the substrate that is formed with a liquid film on the overall surface thereof, and
the second nozzle ejects the second processing liquid along a tangential direction of a rotation circle from an upstream side toward a downstream side of a rotation circle, the rotation circle rotating around the vertical axis in the same direction as the substrate, and the second nozzle is disposed such that an angle between the ejecting direction and the surface of the substrate is within a range of 5° to 15° when viewed from a lateral side.

12. The apparatus according to claim 11 , wherein the second nozzle ejects the second processing liquid outwardly in a radial direction of the rotation circle and is supplied to the substrate such that an angle between the supply direction of the second process

Assignees

• Tokyo Electron Ltd

Inventors

• Higashi Hiroyuki
• Goshi Gentaro
• Otsuka Takahisa

Classifications

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H01L21/02052

  Electricity · mapped topic

• H01L21/67051 Primary

  Electricity · mapped topic

• B08B3/02

  Cleaning by the force of jets or sprays · CPC title