Method and apparatus for calibrating optical path degradation useful for decoupled plasma nitridation chambers

US9865438B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9865438-B2
Application numberUS-201113188866-A
CountryUS
Kind codeB2
Filing dateJul 22, 2011
Priority dateOct 8, 2008
Publication dateJan 9, 2018
Grant dateJan 9, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Methods for matching semiconductor processing chambers using a calibrated spectrometer are disclosed. In one embodiment, plasma attributes are measured for a process in a reference chamber and a process in an aged chamber. Using a calibrated light source, an optical path equivalent to an optical path in a reference chamber and an optical path in an aged chamber can be compared by determining a correction factor. The correction factor is applied to adjust a measured intensity of plasma radiation through the optical path in the aged chamber. Comparing a measured intensity of plasma radiation in the reference chamber and the adjusted measured intensity in the aged chamber provide an indication of changed chamber conditions. A magnitude of change between the two intensities can be used to adjust the process parameters to yield a processed substrate from the aged chamber which matches that of the reference chamber.

First claim

Opening claim text (preview).

We claim: 1. A kit for adjusting an operational parameter setting in a substrate processing chamber, comprising: a radiation source having a wavelength that is representative of a plasma spectrum generated in a chamber; a calibrated radiation detector, calibrated to the radiation source; a reference optical window having a known attenuation at the wavelength from the radiation source; and an adjustment table to adjust the operational parameter of the substrate processing chamber based on a correction factor determined from a measured optical intensity of the radiation source through the reference optical window compared to a measured optical intensity of the radiation source through a used chamber window, where the operational parameter is modified in accordance with the correction factor. 2. The kit as claimed in claim 1 , further comprising a structure to fix a position of the radiation source, the reference optical window and the calibrated radiation detector. 3. The kit as claimed in claim 1 , wherein the adjustment table is implemented in a computing device. 4. The kit as claimed in claim 1 , wherein the wavelength of the radiation source is at a discrete wavelength that coincides with a spectrum peak in the plasma radiation. 5. The kit as claimed in claim 1 , wherein the radiation source is a single narrow band discrete radiation source. 6. The kit as claimed in claim 5 , which further comprises multiple discrete sources. 7. The kit as claimed in claim 1 , wherein the radiation source is a standardized broadband radiation source. 8. The kit as claimed in claim 1 , wherein the radiation source, reference optical window, and calibrated radiation detector form an optical path for measuring an optical intensity through the reference optical window.

Assignees

Inventors

Classifications

  • Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

  • Calibration, base line adjustment, drift correction · CPC title

  • Spectral analysis · CPC title

  • electrically excited, e.g. electroluminescence · CPC title

  • Emission spectrometry · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9865438B2 cover?
Methods for matching semiconductor processing chambers using a calibrated spectrometer are disclosed. In one embodiment, plasma attributes are measured for a process in a reference chamber and a process in an aged chamber. Using a calibrated light source, an optical path equivalent to an optical path in a reference chamber and an optical path in an aged chamber can be compared by determining a …
Who is the assignee on this patent?
Tallavarjula Sairaju, Pradhan Kailash, Nguyen Huy Q, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01J37/32972. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).