Camera module

Patent metadata

Field	Value
Publication number	US-9862809-B2
Application number	US-201615221720-A
Country	US
Kind code	B2
Filing date	Jul 28, 2016
Priority date	Jul 31, 2015
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A camera module that comprises a molded part is provided. The molded part includes a polymer composition that has an in-plane thermal conductivity of about 2.0 W/m-K or more. The polymer composition includes an aromatic polymer and a thermally conductive particulate material.

First claim

What is claimed is:

1. A camera module that comprises a molded part, wherein the molded part includes a polymer composition having an in-plane thermal conductivity of about 2.0 W/m-K or more, wherein the polymer composition includes an aromatic polymer and a thermally conductive particulate material, wherein the camera module comprises a carrier assembly that overlies a base, wherein the base, carrier assembly, or both contain the molded part.

2. The camera module of claim 1 , wherein the thermally conductive particulate material is present in an amount of from about 20 to about 80 parts by weight per 100 parts of the aromatic polymer.

3. The camera module of claim 1 , wherein the thermally conductive particulate material has an average size of from about 1 to about 100 micrometers.

4. The camera module of claim 3 , wherein about 70% by volume or more of the thermally conductive particulate material has an average size of from about 1 to about 100 micrometers.

5. The camera module of claim 1 , wherein the thermally conductive particulate material has an intrinsic thermal conductivity of about 50 W/m-K or more.

6. The camera module of claim 1 , wherein the thermally conductive particulate material includes boron nitride.

7. The camera module of claim 6 , wherein boron nitride constitutes about 50 wt. % or more of the thermally conductive particulate material in the polymer composition.

8. The camera module of claim 1 , wherein aromatic polymers constitute from about 20 wt. % to about 70 wt. % of the polymer composition.

9. The camera module of claim 1 , wherein the aromatic polymer has a glass transition temperature of about 100° C. or more and/or a melting temperature of about 200° C. or more.

10. The camera module of claim 1 , wherein the aromatic polymer is an aromatic polyimide.

11. The camera module of claim 1 , wherein the aromatic polymer is a thermotropic liquid crystalline polymer.

12. The camera module of claim 11 , wherein the liquid crystalline polymer contains repeating units derived from terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, hydroquinone, 4,4′-biphenol, acetaminophen, or a combination thereof.

13. The camera module of claim 1 , wherein the thermally conductive particulate material constitutes from about 1 wt. % to about 50 wt. % of the polymer composition.

14. The camera module of claim 1 , wherein the polymer composition contains from about 10 to about 50 parts by weight of an inorganic material per 100 parts of the aromatic polymer, wherein the inorganic material has a hardness value of about 2.5 or more based on the Mohs hardness scale.

15. The camera module of claim 1 , wherein the inorganic material is in the form of particles.

16. The camera module of claim 15 , wherein the inorganic material includes calcium pyrophosphate, calcium sulfate, barium sulfate, or a combination thereof.

17. The camera module of claim 15 , wherein the particles of the inorganic material have a median size of from about 0.1 to about 35 micrometers.

18. The camera module of claim 1 , wherein the inorganic filler material constitutes from about 20 wt. % to about 60 wt. % of the polymer composition.

19. The camera module of claim 1 , wherein the polymer composition has a through-plane thermal conductivity of about 0.30 W/m-K or more.

Assignees

• Ticona Llc

Inventors

• Kim Young Shin
• Mccullough Kevin A
• Zhao Xinyu

Classifications

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• C09K5/14

  Solid materials, e.g. powdery or granular · CPC title

• C08K3/32

  Phosphorus-containing compounds · CPC title

• C08K3/38 Primary

  Boron-containing compounds · CPC title

• C08K2201/005

  Additives being defined by their particle size in general · CPC title