A Composition, Connector, Process for Improving Bonding Between Two or More Means for Conveying Fluids, and System for Conveying Fluids
US-2015368427-A1 · Dec 24, 2015 · US
Thermally conductive thermoplastic resin compositions and related applications
US9090751B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9090751-B2 |
| Application number | US-201013383469-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2010 |
| Priority date | Jul 24, 2009 |
| Publication date | Jul 28, 2015 |
| Grant date | Jul 28, 2015 |
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Abstract
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Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.
First claim
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What is claimed is: 1. A composition comprising liquid crystalline polymer, in an amount between about 15 and about 75 weight percent of the composition; thermally conductive filler having a thermal conductivity of at least 5 W/mK, in an amount between about 25 and about 85 weight percent of the composition, wherein said thermally conductive filler is at least one selected from the group consisting of calcium fluoride, magnesium oxide, magnesium carbonate, boehmite and zinc sulfide…
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Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9090751B2 cover?
- Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility …
- Who is the assignee on this patent?
- Saga Yuji, Une Narumi, Ticona Llc
- What technology area does this patent fall under?
- Primary CPC classification C08K3/0008. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).