Targeted control of the absorption behavior during laser resealing
US-2017158498-A1 · Jun 8, 2017 · US
US9862597B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9862597-B2 |
| Application number | US-201615371659-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 7, 2016 |
| Priority date | Dec 8, 2015 |
| Publication date | Jan 9, 2018 |
| Grant date | Jan 9, 2018 |
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A method for manufacturing a micromechanical component having a substrate and having a cap connected to the substrate and enclosing with the substrate a first cavity is provided, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, in a first method step an access opening that connects the first cavity to an environment of the micromechanical component being constituted in the substrate or in the cap, in a second method step the first pressure and/or the first chemical composition being established in the first cavity, in a third method step the access opening being sealed with the aid of a laser by the introduction of energy or heat into an absorbing portion of the substrate or of the cap, the introduction of energy or heat being controlled by spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of the substrate or of the cap.
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What is claimed is: 1. A method for manufacturing a micromechanical component having a substrate and a cap connected to the substrate and enclosing with the substrate a first cavity, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, the method comprising: in a first method step, constituting, in one of the substrate and the cap, an access opening that connects the first cavity to an environment of the micromechanical component; in a second method step, establishing at least one of the first pressure and the first chemical composition in the first cavity; and in a third method step, sealing the access opening with the aid of a laser by the introduction of one of energy and heat into an absorbing portion of one of the substrate and the cap, wherein the introduction of one of energy and heat is controlled by a spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of one of the substrate and the cap. 2. The method as recited in claim 1 , wherein the introduction of one of energy and heat is controlled in such a way that the laser beam exhibits one of an electromagnetic wave having a substantially constant intensity over time and an electromagnetic wave having an intensity varying over time. 3. The method as recited in claim 2 , wherein the varying intensity pulses over time. 4. The method as recited in claim 1 , wherein the introduction of one energy and heat is controlled in such a way that the path is a closed path. 5. The method as recited in claim 1 , wherein the introduction of one of energy and heat is controlled in such a way that the path is an annular path. 6. The method as recited in claim 1 , wherein the introduction of one of energy and heat is controlled in such a way that the path is disposed substantially rotationally symmetrically around the access opening. 7. The method as recited in claim 1 , wherein the introduction of one of energy and heat is controlled in such a way that the path is a spiral-shaped path around a point disposed in the surface and inside a projection of the access opening onto the surface. 8. The method as recited in claim 7 , wherein the spiral-shaped path is in the shape of an Archimedean spiral. 9. The method as recited in claim 7 , wherein the laser beam being is spatially displaced in such a way that the laser beam one of moves away from the point moves toward the point. 10. The method as recited in claim 1 , wherein the introduction of one of energy and heat is controlled in such a way that the path is a line segment, a projection of the line segment onto the surface and a projection of the access opening onto the surface overlapping at least in part. 11. The method as recited in claim 1 , wherein the laser beam is spatially displaced in such a way that the line segment is traversed between one and ten times, inclusively. 12. An apparatus for carrying out a method for manufacturing a micromechanical component having a substrate and a cap connected to the substrate and enclosing with the substrate a first cavity, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, the method including, in a first method step, constituting, in one of the substrate and the cap, an access opening that connects the first cavity to an environment of the micromechanical component, in a second method step, establishing at least one of the first pressure and the first chemical composition in the first cavity, and in a third method step, sealing the access opening with the aid of a laser by the introduction of one of energy and heat into an absorbing portion of one of the substrate and the cap, wherein the introduction of one of energy and heat is controlled by a spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of one of the substrate and the cap, the apparatus comprising: a beam deflection system for spatial displacement of the laser beam, the beam deflection system including at least one of: a galvo scanner, an acousto-optic modulator, an electro-optic modulator, a resonant scanner, a piezo scanner, mechanically pivotable optical components, and mechanically pivotable optical subassemblies. 13. The apparatus as recited in claim 12 , wherein the mechanically pivotable optical subassemblies include at least one of wedge plates and lenses.
Seals · CPC title
characterised by their shape · CPC title
Laser sealing · CPC title
Electricity · mapped topic
Shaping the laser beam, e.g. by masks or multi-focusing · CPC title
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