Optoelectronic package
US-2015380895-A1 · Dec 31, 2015 · US
US9859680B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9859680-B2 |
| Application number | US-201414570414-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 15, 2014 |
| Priority date | Dec 17, 2013 |
| Publication date | Jan 2, 2018 |
| Grant date | Jan 2, 2018 |
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Laser modules are provided having electrical connections that are resistant to damage caused by transient or higher order accelerations.
Opening claim text (preview).
What is claimed is: 1. A laser module comprising: a base having a header extending therefrom; a terminal extending a sealed opening in the base; a laser positioned on the header apart from the terminal; a transmission circuit between the laser and the terminal having at least one wire bond with a length that is greater than a width, and the width being greater than a thickness, wherein the at least one wire bond joins the transmission circuit to at least one of the terminal and the laser and wherein the wire bond width is aligned within 15 degrees of a direction of an anticipated transient acceleration wherein the wire bond has an arc shape that provides resistance to anticipated transient accelerations perpendicular to the width of the wire bond and wherein the wire bond has an arc height and an arc span and the arc span is greater than the arc height to provide columnar resistance to accelerations along an arc path of the wire bond. 2. The laser module of claim 1 , wherein the anticipated transient acceleration is at least 600 times the acceleration of gravity. 3. The laser module of claim 1 , wherein the wire bond has a parabolic arc shape. 4. The laser module of claim 1 , wherein the wire bond has an unsupported length that is at least 40 percent shorter than a distance between the terminal and the laser. 5. The laser module of claim 1 , wherein the wire bond comprises a ribbon. 6. The laser module of claim 1 , wherein the wire bond has a width that is at least 20 percent greater than a thickness. 7. The laser module of claim 1 , wherein the direction of anticipated transient acceleration is determined based upon more than one acceleration arising from more than one direction. 8. A laser module comprising: a base having a header extending therefrom; a terminal extending from a sealed opening in the base; a laser positioned on the header apart from the terminal; a transmission circuit between the laser and the terminal having at least one wire bond with a length that is greater than a width, and the width being greater than a thickness, and an electrically conductive pad positioned proximate to the terminal with the wire bond connected at one end to the terminal and at another end to the electrically conductive pad; wherein the electrically conductive pad is positioned relative to the terminal so that the width of a wire bond that joins the terminal to the conductive pad is aligned within 15 degrees of an anticipated higher order acceleration, wherein the wire bond has an arc shape that provides resistance to anticipated transient accelerations perpendicular to the width of the wire bond and wherein the wire bond has an arc height and an arc span and the arc span is greater than the arc height to provide columnar resistance to accelerations along an arc path of the wire bond. 9. The laser module of claim 8 , wherein the anticipated higher order acceleration is at least 600 times the acceleration of gravity. 10. The laser module of claim 8 , wherein the wire bond has a parabolic arc shape. 11. The laser module of claim 8 , wherein the wire bond has an unsupported length that is at least 40 percent shorter than a distance between the terminal and the laser. 12. The laser module of claim 8 , wherein the wire bond comprises a ribbon. 13. The laser module of claim 8 , wherein the wire bond has a width that is at least 20 percent greater than a thickness. 14. The laser module of claim 8 , wherein a direction of the higher order acceleration is determined based upon more than one acceleration arising from more than one direction.
changes in dispositions · CPC title
Dispositions of multiple bond wires · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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