Module component

Patent metadata

Field	Value
Publication number	US-9854677-B2
Application number	US-201615214611-A
Country	US
Kind code	B2
Filing date	Jul 20, 2016
Priority date	Sep 3, 2014
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.

First claim

What is claimed is:

1. A module component comprising:
a substrate including a thermoplastic resin base material; and
an electronic component ultrasonically bonded on the substrate; wherein
the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential;
the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes; and
the substrate has anisotropy of an elastic modulus in an in-plane direction on the component loading surface.

2. The module component according to claim 1 , wherein
the electronic component further includes a second substrate connecting electrode including a planar conductor provided on the substrate mounting surface separately from the first substrate connecting electrodes, and connected at a different potential or a substantially different potential from the first substrate connecting electrodes;
the substrate further includes a second component connecting electrode including a planar conductor provided on the component loading surface separately from the first component connecting electrode, and bonded to the second substrate connecting electrode; and
the first component connecting electrode surrounds the second component connecting electrode.

3. The module component according to claim 1 , wherein the substrate further includes a first interlayer connection conductor provided inside the substrate and electrically conducted with the first component connecting electrode.

4. The module component according to claim 3 , wherein the substrate includes a plurality of the first interlayer connection conductors.

5. The module component according to claim 3 , wherein the first interlayer connection conductor is electrically conducted with a portion between respective bonding regions of the plurality of first substrate connecting electrodes, in one of the first component connecting electrodes.

6. The module component according to claim 3 , wherein the substrate further includes a first inner layer planar conductor electrically conducted with the first component connecting electrode through the first interlayer connection conductor.

7. The module component according to claim 6 , wherein the first inner layer planar conductor overlaps with the first component connecting electrode.

8. The module component according to claim 1 , wherein the first component connecting electrode has a long side and a short side, and an elastic modulus of the substrate in a direction in which the long side of the first component connecting electrode extends is lower than an elastic modulus of the substrate in a direction in which the short side of the first component connecting electrode extends.

9. The module component according to claim 1 , wherein the plurality of first substrate connecting electrodes are arranged in two lines along a lateral width direction on the substrate mounting surface.

10. The module component according to claim 1 , further comprising a plurality of second substrate connecting electrodes connected at a different potential or a substantially different potential from the plurality of first substrate connecting electrodes.

11. The module component according to claim 1 , wherein the thermoplastic resin base material is a liquid crystal polymer.

12. The module component according to claim 1 , wherein the thermoplastic resin base material includes a plurality of liquid crystal polymer resin sheets.

13. The module component according to claim 12 , further comprising at least one interlayer connection conductor provided inside the substrate and electrically conducted with the first component connecting electrode, wherein the at least one interlayer connection conductor is provided in at least one of the plurality of liquid crystal polymer resin sheets, and passes through the at least one of the plurality of liquid crystal polymer resin sheets in a thickness direction thereof.

14. The module component according to claim 1 , wherein the thermoplastic resin base material causes uniaxial or biaxial crystalline orientation along the component loading surface.

15. The module component according to claim 1 , wherein the substrate including the thermoplastic resin base material is a resin laminate that has anisotropy of an elastic modulus in an in-plane direction on the component loading surface.

16. The module component according to claim 1 , wherein the thermoplastic resin base material is a polyimide.

17. The module component according to claim 1 , wherein the substrate connecting electrodes of the electronic component and the component connecting electrodes of the substrate are directly welded to each other.

18. The module component according to claim 1 , wherein the thermoplastic resin base material has flexibility.

19. The module component according to claim 1 , wherein the thermoplastic resin base material has no flexibility.

Assignees

• Murata Manufacturing Co

Inventors

• Tago Shigeru
• Shinagawa Hirofumi
• Kawata Masaki
• Ito Yuki

Classifications

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title