Optical communication component cooling

Patent metadata

Field	Value
Publication number	US-9851520-B2
Application number	US-201615135846-A
Country	US
Kind code	B2
Filing date	Apr 22, 2016
Priority date	Apr 22, 2016
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

An optical communication package includes a circuit layer, an optical component electrically coupled to the circuit layer to optically communicate outside of the package, and a thermoelectric cooler electrically coupled to the circuit layer and disposed to transfer heat from the optical component to the circuit layer.

First claim

What is claimed is:

1. An optical communication package comprising:
a circuit layer;
a optical component disposed parallel to and below the circuit layer and electrically coupled to the circuit layer to optically communicate outside of the package; and
a thermoelectric cooler that:
is embedded in an interposer layer between the circuitry layer and the optical components, and is thermally coupled to and disposed directly between the circuit layer and the optical component; and
comprises doped semiconductor columns that conduct heat that are axially disposed in an orthogonal manner to the optical component and circuit layer.

2. The optical communication package of claim 1 wherein the circuit layer is coupled to the optical component and the thermoelectric cooler by a redistribution layer positioned between the circuit layer and the optical component.

3. The optical communication package of claim 2 wherein the redistribution layers comprises two layers sandwiching the interposer layer.

4. The optical communication package of claim 3 wherein the thermoelectric cooler is embedded in the interposer layer and positioned directly between the optical component and the circuit layer.

5. The optical communication package of claim 4 and further comprising multiple electrical contacts positioned to connect the two layers of the redistribution layer.

6. The optical communication package of claim 1 wherein the optical component comprises a vertical cavity surface emitting laser (VCSEL) and a photo detector (PD).

7. The optical communication package of claim 1 wherein the circuit layer comprises a complementary metal oxide semiconductor (CMOS) layer that includes a processor.

8. The optical communication package of claim 1 wherein the thermoelectric cooler comprises two thermal plates coupled to a plurality of thermoelectric elements.

9. An optical communication package comprising:
a substrate having an opening;
at least two redistribution layers supported by and electrically coupled to the substrate;
a circuit layer supported by and electrically coupled to the redistribution layer;
an optical components disposed parallel to the circuit layer and electrically coupled to the redistribution layer and the circuit layer via the at least two redistribution layers and positioned to optically communicate through the opening in the substrate; and
a thermoelectric cooler that:
is thermally coupled to and is disposed directly between the at least two redistribution layers between the circuit layer and the optical component; and
comprises doped semiconductor columns that conduct heat that are axially disposed in an orthogonal manner to the optical component and circuit layer.

10. The optical communication package of claim 9 wherein the redistribution layers comprises two layers sandwiching the interposer layer.

11. The optical communication package of claim 10 wherein the thermoelectric cooler is embedded in the interposer layer and positioned directly between the optical components and the circuit layer.

12. The optical communication package of claim 11 and further comprising multiple contacts positioned to connect the two layers of the redistribution layer.

13. The optical communication package of claim 9 wherein the optical components comprises a vertical cavity surface emitting laser (VCSEL) and a photo detector (PD).

14. The optical communication package of claim 9 wherein the circuit layer comprises a complementary metal oxide semiconductor (CMOS) layer that includes a processor.

15. The optical communication package of claim 9 wherein the thermoelectric cooler comprises two thermal plates coupled to a plurality of thermoelectric elements.

16. A system comprising:
an optical communications chip having a circuit layer;
an interposer layer having at least two redistribution layers;
an optical component disposed parallel to the circuit layer and electrically coupled to the circuit layer via the at least two redistribution layers;
a thermoelectric cooler that:
is thermally coupled to and disposed directly between the two redistribution layers disposed between the circuit layer and the optical component; and
comprises doped semiconductor columns that conduct heat that are axially disposed in an orthogonal manner to the optical component and circuit layer; and

a printed circuit board (PCB) supporting a second optical component optically coupled to the optical component.

17. The system of claim 16 wherein the printed circuit board comprises a router.

18. The system of claim 16 wherein the first optical component comprises an array of lasers and an array of photo diodes, and the second optical component comprises a pair of optical fiber bundles, each optical fiber bundle being optically coupled to respective arrays of lasers and photo diodes.

19. The system of claim 18 wherein the printed circuit board comprises an opening through which the optical fiber bundles extend to facilitate optical communications outside of the system.

20. The system of claim 16 and further comprising a thermally conductive plate thermally coupled to the circuit layer and wherein the thermoelectric cooler is embedded in the interposer layer between the thermally conductive plate and the first optical component.

Assignees

• Futurewei Technologies Inc

Inventors

• Gektin Vadim
• Fu Xing
• Yang Chengpeng

Classifications

• G02B6/4271 Primary

  with thermo electric cooling · CPC title

• H01S5/02415

  by using a thermo-electric cooler [TEC], e.g. Peltier element · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4295

  coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors · CPC title

• G02B6/4272

  with mounting substrates of high thermal conductivity · CPC title