Radio frequency optical module and optical transmission apparatus including the same

Patent metadata

Field	Value
Publication number	US-9054809-B2
Application number	US-201414175225-A
Country	US
Kind code	B2
Filing date	Feb 7, 2014
Priority date	May 6, 2013
Publication date	Jun 9, 2015
Grant date	Jun 9, 2015

Abstract

Provided is a transistor outline (TO)-CAN type optical module and an optical transmission apparatus including the same. The optical module includes a stem, a thermo-electric cooler (TEC) on the stem, a first sub-mount on the TEC, an optical element on the first sub-mount, a plurality of electrode lead wirings inserted from an outside to an inside of the stem and disposed adjacent to the TEC and the optical element, a second sub-mount between the electrode lead wirings and the optical element, radio frequency (RF) transmission lines on the second sub-mount, a plurality of bonding wires connecting the RF transmission lines and the optical element, and the RF transmission lines and the electrode lead wirings, and an impedance matching unit disposed around the RF transmission lines and the electrode lead wirings, and controlling impedances of the RF transmission lines and the electrode lead wires.

First claim

What is claimed is:

1. An optical module comprising:
a stem;
a thermo-electric cooler (TEC) on the stem;
a first sub-mount on the TEC;
an optical element on the first sub-mount;
a plurality of electrode lead wirings inserted from an outside to an inside of the stem and disposed adjacent to the TEC and the optical element;
a second sub-mount between the electrode lead wirings and the optical element;
radio frequency (RF) transmission lines on the second sub-mount;
a plurality of bonding wires connecting the RF transmission lines and the optical element, the plurality of bonding wires connecting the RF transmission lines and the electrode lead wires; and
an impedance matching unit disposed around the RF transmission lines and the electrode lead wirings, the impedance matching unit controlling impedances of the RF transmission lines and the electrode lead wirings.

2. The optical module of claim 1 , wherein the impedance matching unit comprises:
a first impedance matching unit including the electrode lead wirings and disposed around the electrode lead wirings to match the impedances of the electrode lead wirings; and
a second impedance matching unit including the RF transmission lines and disposed around the electrode lead wirings to match the impedances of the RF transmission lines.

3. The optical module of claim 2 , wherein:
the electrode lead wirings respectively have one side opposite to the TEC and the second sub-mount; and
the first impedance matching unit comprises a GND metal stand separated from another side of the electrode lead wirings.

4. The optical module of claim 3 , wherein the GND metal stand has the same height as that to the TEC, the second sub-mount, or the electrode lead wirings.

5. The optical module of claim 3 , wherein the GND metal stand encloses the electrode lead wirings.

6. An optical module of claim 3 , comprising:
a stem;
a thermo-electric cooler (TEC) on the stem;
a first sub-mount on the TEC;
an optical element on the first sub-mount;
a plurality of electrode lead wirings inserted from an outside to an inside of the stem and disposed adjacent to the TEC and the optical element;
a second sub-mount between the electrode lead wirings and the optical element;
radio frequency (RF) transmission lines on the second sub-mount;
a plurality of bonding wires connecting the RF transmission lines and the optical element, the plurality of bonding wires connecting the RF transmission lines and the electrode lead wires; and
an impedance matching unit disposed around the RF transmission lines and the electrode lead wirings, the impedance matching unit controlling impedances of the RF transmission lines and the electrode lead wirings,
the impedance matching unit including:
a first impedance matching unit including the electrode lead wirings and disposed around the electrode lead wirings to match the impedances of the electrode lead wirings; and
a second impedance matching unit including the RF transmission lines and disposed around the electrode lead wirings to match the impedances of the RF transmission lines,

wherein the electrode lead wirings respectively have one side opposite to the TEC and the second sub-mount, and the first impedance matching unit comprises a GND metal stand separated from another side of the electrode lead wirings, and
the first impedance matching unit further comprises a third sub-mount between the GND metal stand and the electrode lead wirings.

7. The optical module of claim 6 , wherein the third sub-mount comprises dielectric material such as aluminium oxide, aluminium nitride, polyimide, or Teflon.

8. The optical module of claim 6 , further comprising an adhesion metal layer between the third sub-mount and the GND metal stand.

9. The optical module of claim 8 , wherein the adhesion metal layer comprises copper.

10. The optical module of claim 6 , wherein the stem has a cylindrical shape and the GND metal stand has a trapezoidal surface which is separated at a constant distance from a side wall of the cylindrical shaped stem.

11. The optical module of claim 3 , wherein the GND metal stand comprises:
a ground metal; and
gold plated on the ground metal.

12. The optical module of claim 2 , wherein the second impedance matching unit further comprises ground wirings disposed on both sides of the RF transmission lines on the second sub-mount.

13. The optical module of claim 1 , wherein the first and second sub-mounts have the same thickness.

14. An optical transmission apparatus comprising:
a pulse generating unit generating an radio frequency (RF) voltage signal;
a signal driver connected to the pulse generating unit and converting the RF voltage signal into an RF current signal; and
an optical module connected to the signal driver and transmitting an optical signal by using the RF current signal from the signal driver, wherein the optical module comprises:
a stem;
a thermo-electric cooler (TEC) on the stem;
a first sub-mount on the TEC;
an optical element on the first sub-mount;
a plurality of electrode lead wirings inserted from an outside to an inside of the stem and disposed adjacent to the TEC and the optical element;
a second sub-mount between the electrode lead wirings and the optical element;
radio frequency (RF) transmission lines on the second sub-mount;
a plurality of bonding wires connecting the RF transmission lines and the optical element, the plurality of bonding wires connecting the RF transmission lines and the electrode lead wirings; and
an impedance matching unit disposed around the RF transmission lines and the electrode lead wirings, the impedance matching unit controlling impedances of the RF transmission lines and the electrode lead wirings.

15. The optical transmission apparatus of claim 14 , further comprising a printed circuit board (PCB) having the signal driver mounted thereon.

16. The optical transmission apparatus of claim 15 , further comprising a flexible PCB connecting the optical module and the PCB.

17. The optical transmission apparatus of claim 14 , further comprising an optical fiber arranged to the optical element.

18. The optical transmission apparatus of claim 14 , wherein the optical element comprises a laser diode.

19. The optical transmission apparatus of claim 14 , wherein the pulse generating unit comprises a pulse power generator.

20. The optical transmission apparatus of claim 14 , wherein the signal driver comprises a laser diode driver.

21. The optical module of claim 1 , wherein the first sub-mount is separated from the second sub-mount by a gap.

22. The optical module of claim 1 , wherein no RF transmission line is provided on the first sub-mount and no optical element is provided on the second sub-mount.

23. The optical transmission apparatus of claim 14 , wherein the first sub-mount is separated from the second sub-mount by a gap.

24. The optical transmission apparatus of claim 14 , wherein no RF transmission line is provided on the first sub-mount and no optical element is provided on the second sub-mount.

Assignees

• Korea Electronics Telecomm
• Phovel Co Ltd

Inventors

• Han Young-Tak
• Shin Jang Uk
• Park Sang Ho
• Baek Yongsoon
• Kim Jeong Soo

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/50 Primary

  Bond wires · CPC title

• H01S5/02256

  Electricity · mapped topic

• H01S5/02236

  Electricity · mapped topic

• H01S5/02212

  Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis · CPC title