Temperature sensor

Patent metadata

Field	Value
Publication number	US-9851262-B2
Application number	US-201314425605-A
Country	US
Kind code	B2
Filing date	Sep 3, 2013
Priority date	Sep 6, 2012
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

The temperature sensor is provided with a pair of lead frames, a sensor portion connected to the pair of lead frames, and an insulating holding portion which is fixed to the pair of lead frames and holds the lead frames. The sensor portion is provided with an insulating film; a thin film thermistor portion formed as a pattern on the surface of the insulating film with a thermistor material; a pair of interdigitated electrodes formed as patterns having multiple comb portions and facing each other on the thin film thermistor portion; and a pair of pattern electrodes connected to the pair of interdigitated electrodes and formed as patterns on the surface of the insulating film. The pair of lead frames is extended and adhered to the surface of the insulating film disposing the thin film thermistor portion therebetween and is connected to the pair of pattern electrodes.

First claim

What is claimed is:

1. A temperature sensor comprising:
a pair of lead frames;
a sensor portion connected to the pair of lead frames; and
an insulating holding portion which is fixed to the pair of lead frames and holds the lead frames,
wherein the sensor portion further comprises:
an insulating film;
a thin film thermistor portion formed as a pattern on the surface of the insulating film with a thermistor material;
a pair of interdigitated electrodes formed as patterns having multiple comb portions and facing each other on at least one of the top or the bottom of the thin film thermistor portion; and
a pair of pattern electrodes that respectively have ends connected to the pair of interdigitated electrodes and other ends connected to the pair of lead frames, and are formed as patterns on the surface of the insulating film, and
wherein the pair of lead frames is extended on both sides of the thin film thermistor portion at a certain interval in the surface of the insulating film.

2. The temperature sensor according to claim 1 , wherein the insulating film is generally rectangular, the pair of lead frames extends across substantially the entire length in the extending direction of the insulating film, the thin film thermistor portion is arranged at one end of the insulating film, and the pattern electrodes are formed extending from one end to the other end of the insulating film and are connected to the lead frames at the other end of the insulating film, respectively.

3. The temperature sensor according to claim 2 , wherein the pair of pattern electrodes is formed in a meander shape.

4. The temperature sensor according to claim 1 , wherein an insulating protective sheet covering at least the lead frames is adhered to the surface of the insulating film.

5. The temperature sensor according to claim 1 , wherein the thin film thermistor portion consists of a metal nitride represented by the general formula: Ti x Al y N z (where 0.70≦y/(x+y)≦0.95, 0.4≦z ≦0.5, and x+y+z=1), and the crystal structure thereof is a hexagonal wurtzite-type single phase.

Assignees

• Mitsubishi Materials Corp

Inventors

• Nagatomo Noriaki
• Inaba Hitoshi
• Tanaka Hiroshi
• Takeshima Kazuta

Classifications

• H01C1/1413

  Terminals or electrodes formed on resistive elements having negative temperature coefficient · CPC title

• H01C7/041

  formed with two or more layers · CPC title

• G01K13/08

  in rotary movement · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C7/04

  having negative temperature coefficient · CPC title