Complex plating film formed using multi-layer graphene-coated metal particles through electric explosion and method of manufacturing the complex plating film

Patent metadata

Field	Value
Publication number	US-9850592-B2
Application number	US-201514804398-A
Country	US
Kind code	B2
Filing date	Jul 21, 2015
Priority date	Jul 21, 2014
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

Provided is a method of forming a complex plating film using multi-layer graphene metal particles. The method of forming the plating film may include preparing a powder with a metal particle structure coated with multi-layer graphene, and forming a plating film by adding the powder to a plating solution through electric plating.

First claim

What is claimed is:

1. A method of forming a complex plating film on a surface of a base material, the method comprising:
adding multi-layer graphene-coated metal powders to a plating solution; and
forming a plating film on the surface of the base material by performing electric plating in the plating solution,
wherein the multi-layer graphene-coated metal powders are dispersed in the plating film.

2. The method of claim 1 , wherein the multi-layer graphene-coated metal powders are prepared through electric explosion.

3. The method of claim 2 , wherein the multi-layer graphene-coated metal powders are formed by
coating a metal wire with a carbon-based material, and
performing electric explosion of the carbon-based-material-coated metal wire in a solution or in air, and
the carbon-based material comprises graphene or graphite.

4. The method of claim 3 , wherein the metal wire comprises any one or any combination of any two or more of copper, nickel, aluminum, iron, gold, and silver.

5. The method of claim 3 , wherein each of the multi-layer graphene-coated metal powders comprises a metal core and a multi-layer graphene coating, which comprises 1 to 20 carbon atom layers, on a surface of the metal core.

6. The method of claim 3 , wherein the coating of the metal wire with the carbon-based material comprises
synthesizing the graphene on a surface of the metal wire or
transferring the graphene synthesized on a substrate onto the surface of the metal wire.

7. The method of claim 3 , wherein the multi-layer graphene-coated metal powders are formed by the electric explosion of the metal wire in the solution, comprising at least one selected from the group consisting of isopropyl alcohol, acetone, ethanol, methanol, carbon compound solvents, glycols including carbon, glycerin, triethanolamine, methylene chloride, deionized water, distilled water, hydrogen peroxide and a metal compound solvent.

8. The method of claim 3 , wherein the multi-layer graphene-coated metal powders are formed by the electric explosion of the metal wire in the air comprising a hydrocarbon gas which comprises at least one selected from the group consisting of methane, ethane, propane, butane, acetylene, cyclopentane and cyclohexane.

9. The method of claim 1 , wherein the plating solution comprises at least one selected from the group consisting of anhydrous copper sulfate, sulfuric acid and hydrochloric acid.

10. The method of claim 9 , wherein the plating solution further comprises an additive.

11. The method of claim 10 , wherein the additive comprises at least one selected from the group consisting of an accelerator, a leveling agent and a brightener.

12. The method of claim 1 , wherein a concentration of the multi-layer graphene-coated metal powders in the plating solution is 1 to 10000 part per million (PPM).

13. A complex plating film, comprising:
a plating film coated on a surface of a base material, the plating film comprising a first metal; and
multi-layer graphene-coated metal powders dispersed in the plating film, each of the multi-layer graphene-coated metal powders comprising a second metal.

14. The film of claim 13 , wherein
the first metal comprises any one or any combination of any two or more of copper, nickel, aluminum, iron, gold, and silver, and
the second metal comprises any one or any combination of any two or more of copper, nickel, aluminum, iron, gold, and silver.

15. The film of claim 14 , wherein the plating film comprises thickness of 2 to 50 μm.

Assignees

• Research & Business Found Sungkyunkwan Univ

Inventors

• Suh Su-Jeong
• Song Young-Il
• Park Jung-Ho
• Park Jung-Kab
• Kim Tae-Yoo
• Son Hwa-Jin
• Shin Jin-Ha
• Lee Mi-Ri
• Lee Jungwoo
• Lee Changhyoung
• Cho Younglae
• Baeg Seung-Bin
• Ahn Byung-Wook
• Yun Sook-Young

Classifications

• C25D15/00 Primary

  Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires · CPC title

• C25D3/54

  of metals not provided for in groups C25D3/04 - C25D3/50 · CPC title

• C25D3/38

  of copper · CPC title

• C25D3/48

  of gold · CPC title

• C25D3/20

  of iron · CPC title