Heat transfer device for wave soldering

Patent metadata

Field	Value
Publication number	US-9232664-B2
Application number	US-201314102994-A
Country	US
Kind code	B2
Filing date	Dec 11, 2013
Priority date	Jan 2, 2013
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.

First claim

What is claimed is:

1. A method comprising:
moving a circuit board joined with a heat transfer device relative to a wave of molten solder;
bringing the heat transfer device in contact with the wave of molten solder;
conducting heat from the wave of molten solder to a leading edge of the circuit board via the heat transfer device to preheat the leading edge of the circuit board before the leading edge of the circuit board contacts the wave of molten solder; and
bringing a bottom surface of the circuit board in contact with the wave of molten solder to form a solder connection between a plane and a pin-in-hole component, wherein the heat transfer device comprises an adjustable mechanism for varying the conduction of heat from the wave of molten solder to the plane.

2. The method of claim 1 , further comprising:
removing the heat transfer device from the circuit board.

3. The method of claim 1 , wherein conducting heat from the wave of molten solder to the leading edge of the circuit board via the heat transfer device comprises:
preheating the leading edge of the circuit board to a temperature within about 10% to about 15% of the set point temperature of the wave of molten solder.

4. The method of claim 1 , wherein the heat transfer device is a component independent from the circuit board.

5. The method of claim 1 , wherein the heat transfer device is an integrated component of the circuit board.

6. The method of claim 1 , wherein the heat transfer device is physically coupled to the leading edge of the circuit board via a connection region which provides a thermally conductive path between the heat transfer device and the circuit board.

7. The method of claim 1 , wherein the adjustable mechanism of the heat transfer device comprises perforations or cavities used to tune thermal conduction between the wave of molten solder and the circuit board.

8. A method comprising:
moving a circuit board and a heat transfer device relative to a wave of molten solder, the heat transfer device is coupled to an electrical trace at a leading edge of the circuit board;
bringing the heat transfer device in contact with the wave of molten solder;
conducting heat from the wave of molten solder to the electrical trace at the leading edge of the circuit board via the heat transfer device to pre-heat the electrical trace before the leading edge of the circuit board contacts the wave of molten solder; and
bringing a bottom surface of the circuit board in contact with the wave of molten solder to form a solder connection between the electrical trace and a pin-in-hole component, wherein the heat transfer device comprises an adjustable mechanism for varying the conduction of heat from the wave of molten solder to the electrical trace.

9. The method of claim 8 , further comprising:
removing the heat transfer device from the circuit board.

10. The method of claim 8 , wherein conducting heat from the wave of molten solder to the electrical trace at the leading edge of the circuit board via the heat transfer device comprises:
preheating the leading edge of the circuit board to a temperature within about 10% to about 15% of the set point temperature of the wave of molten solder.

11. The method of claim 8 , wherein the heat transfer device is a component independent from the circuit board.

12. The method of claim 8 , wherein the heat transfer device is an integrated component of the circuit board.

13. The method of claim 8 , wherein the heat transfer device is physically coupled to the electrical trace at the leading edge of the circuit board via a connection region which provides a thermally conductive path between the heat transfer device and the electrical trace.

14. The method of claim 8 , wherein the adjustable mechanism of the heat transfer device comprises perforations or cavities used to tune thermal conduction between the wave of molten solder and the electrical trace.

15. A method comprising:
moving a circuit board and a heat transfer device relative to a wave of molten solder, the heat transfer device is coupled to a plane at a leading edge of the circuit board;
bringing the heat transfer device in contact with the wave of molten solder;
preheating the plane at the leading edge of the circuit board before the leading edge of the circuit board contacts the wave of molten solder by using the heat transfer device to conduct heat from the wave of molten solder to the plane; and
bringing a bottom surface of the circuit board in contact with the wave of molten solder to form a solder connection between the plane and a pin-in-hole component, wherein the heat transfer device comprises an adjustable mechanism for varying the conduction of heat from the wave of molten solder to the plane.

16. The method of claim 15 , wherein preheating the plane at the leading edge of the circuit board comprises:
preheating the leading edge of the circuit board to a temperature within about 10% to about 15% of the set point temperature of the wave of molten solder.

17. The method of claim 15 , wherein heat transfer device is a component independent from the circuit board.

18. The method of claim 15 , wherein the heat transfer device is an integrated component of the circuit board.

19. The method of claim 15 , wherein the heat transfer device is physically coupled to the plane at the leading edge of the circuit board via a connection region which provides a thermally conductive path between the heat transfer device and the plane.

20. The method of claim 15 , wherein the adjustable mechanism of the heat transfer device comprises perforations or cavities used to tune thermal conduction between the wave of molten solder and the plane.

Assignees

• IBM

Inventors

• Hugo Stephen M
• Kelly Matthew S

Classifications

• H05K1/0292

  having a modifiable lay-out, i.e. adapted for engineering changes or repair (H05K1/0293 takes precedence) · CPC title

• H05K3/3468

  Application of molten solder, e.g. dip soldering · CPC title

• H05K3/3447 Primary

  Lead-in-hole components · CPC title

• H05K2201/09127

  PCB or component having an integral separable or breakable part · CPC title

• H05K13/04

  Mounting of components {, e.g. of leadless components} · CPC title