Wiring board, electronic device, and electronic module

Patent metadata

Field	Value
Publication number	US-9848491-B2
Application number	US-201515305233-A
Country	US
Kind code	B2
Filing date	Apr 22, 2015
Priority date	Apr 22, 2014
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A wiring board of the present invention comprises an insulating base comprising a main face a side face; a cutout section having a quadrilateral shape opened in the main face and the side face; an electrode disposed on an inner face of the cutout section; and a wiring conductor disposed on one of an inner part and a surface of the insulating base, and connected to the electrode. A side wall of the cutout section comprises a protruding portion that curves and protrudes outward relative to the side face at a center region in a direction along the side face.

First claim

The invention claimed is:

1. A wiring board comprising:
an insulating base comprising a main face and a side face;
a cutout section having a quadrilateral shape opened in the main face and the side face;
an electrode disposed on an inner face of the cutout section; and
a wiring conductor disposed on one of an inner part and a surface of the insulating base, and connected to the electrode,
wherein
a side wall of the cutout section comprises a protruding portion that curves and protrudes outward relative to the side face at a center region in a direction along the side face.

2. The wiring board according to claim 1 , wherein
bulging of the protruding portion outward relative to the side face gradually increases as it gets further from each laterally neighboring region of the side wall of the cutout section toward an apex in a center region.

3. The wiring board according to claim 1 , wherein
the cutout section is line-symmetric with the apex of the protruding portion positioned on a center line when viewed from the bottom.

4. The wiring board according to claim 1 , wherein
a portion of the cutout section located around corner portion in each end region of the side wall curves inward of the side face.

5. The wiring board according to claim 1 , wherein
an apex of the protruding portion is located at a center in a direction along the side face of the side wall of the cutout section.

6. The wiring board according to claim 1 , wherein
the cutout section is disposed on an inner side of a cutout with a greater width.

7. The wiring board according to claim 1 , wherein
the side wall of the protruding portion has a convex shape in a center region in a direction along the side face of the side wall in a vertical cross-section.

8. The wiring board according to claim 1 , wherein
the cutout section is opened in the other main face opposite the main face.

9. An electronic device comprising:
the wiring board according to claim 1 ; and
an electronic component mounted on the wiring board.

10. An electronic module comprising:
the electronic device according to claim 9 ; and
a module board;
wherein
the electrode of the electronic device is connected to a connection pad of the module board by a bonding material.

Assignees

• Kyocera Corp

Inventors

• Ueki Nobuhiro
• Umino Hidehisa
• Moriyama Yousuke

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• H10W70/657

  on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers · CPC title