Optimization of high resolution digitally encoded laser scanners for fine feature marking

Patent metadata

Field	Value
Publication number	US-9842665-B2
Application number	US-201414323954-A
Country	US
Kind code	B2
Filing date	Jul 3, 2014
Priority date	Feb 21, 2013
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

First claim

I claim:

1. A method, comprising:
receiving a pattern description stored in at least one computer readable storage medium, the pattern description comprising a definition of at least one pattern feature associated with a scan vector that is associated with a laser beam deflection angle; and
directing a laser beam over a fixed scan area based on the pattern description, wherein the laser beam is directed over the fixed scan area with a transverse displacement resolution that is less than 1/20 of a laser beam diameter.

2. The method of claim 1 , wherein an area of the fixed scan area is at least one square meter.

3. The method of claim 2 , wherein the transverse displacement resolution is less than 1 μm.

4. The method of claim 1 , wherein the fixed scan area is square or circular.

5. The method of claim 4 , further comprising directing the laser beam over a substrate situated in the fixed scan area, wherein at least one of a laser beam power, pulse energy, pulse repetition rate, and laser beam diameter is selected so as to process the substrate.

6. The method of claim 1 , wherein the transverse displacement resolution is less than 0.5 μm.

7. The method of claim 6 , wherein the fixed scan area is square and has an area of at least one quarter square meter.

8. The method of claim 1 , wherein directing the laser beam includes using multi-point extrapolation and averaging to direct the laser beam.

9. An apparatus, comprising:
a laser configured to produce a processing beam;
an optical system; and
a scan controller configured to receive a pattern description, the pattern description comprising a definition of at least one pattern feature associated with a scan vector that is associated with a laser beam deflection angle;
wherein the scan controller is configured to control the optical system to scan the processing beam with respect to a scan area so as to direct the processing beam over the scan area based on the pattern description to generate a pattern according to the pattern description, wherein the processing beam is directed over the scan area with a transverse displacement resolution that is less than 1/10 of a processing beam diameter.

10. The apparatus of claim 9 , wherein the scan area is rectangular and the transverse offset is less than 1/10 5 of a scan area length.

11. The apparatus of claim 9 , wherein the scan area is rectangular and the transverse offset is less than 1/10 6 of a scan area length.

12. The apparatus of claim 9 , wherein the scan controller couples scan control signals to the optical system so that the scan control signals correspond to the scan vectors to within at least 0.0015%.

13. The apparatus of claim 9 , wherein the scan controller couples scan control signals to the optical system so that the scan control signals correspond to the scan vectors to within at least 0.0008%.

14. The apparatus of claim 9 , wherein the scan controller couples scan control signals to the optical system so that the scan control signals correspond to the scan vectors to within at least 0.0004%.

15. The apparatus of claim 9 , wherein the scan controller couples scan control signals to the optical system so that the scan control signals correspond to the scan vectors to within at least 0.0001%.

16. The method of claim 1 , further comprising:
selecting a laser beam diameter;
situating a substrate to be scanned in the fixed scan area, wherein the fixed scan area is associated with the a scan plane having a selected laser beam diameter; and
exposing the substrate to a laser beam with the selected laser beam diameter, wherein the laser beam is directed over the fixed scan area by scanning the laser beam with angular scan increments corresponding to less than 1/10 of the laser beam diameter at the fixed scan area.

17. The method of claim 16 , wherein the laser beam is scanned with angular scan increments corresponding to less than 1/100 of the laser beam diameter at the scan plane.

18. The method of claim 16 , wherein the laser beam is scanned with angular scan increments corresponding to less than 1/1000 of the laser beam diameter at the scan plane.

19. The method of claim 16 , wherein the selected laser beam diameter is between 10 μm and 100 μm.

20. The method of claim 16 , wherein the fixed scan area is at least 1 square meter.

Assignees

• Nlight Photonics Corp
• Nlight Inc

Inventors

• Gross Ken

Classifications

• H05K3/027

  the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles · CPC title

• H05K2203/1142

  Conversion of conductive material into insulating material or into dissolvable compound · CPC title

• H05K3/02

  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• H05K2201/026

  Nanotubes or nanowires · CPC title