Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, method for manufacturing electronic device, and electronic device

Patent metadata

Field	Value
Publication number	US-9841679-B2
Application number	US-201615158848-A
Country	US
Kind code	B2
Filing date	May 19, 2016
Priority date	Dec 12, 2013
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (P) having a partial structure represented by General Formula (X), and a compound capable of generating an acid upon irradiation with actinic ray or radiation.

First claim

What is claimed is:

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:
a resin (P) having a partial structure represented by General Formula (X), and
a compound capable of generating an acid upon irradiation with actinic ray or radiation,

wherein in General Formula (X), R 1 to R 3 each independently represents a hydrogen atom or an organic group, at least two of R 1 to R 3 are bonded to each other to form a ring structure, Z is a divalent alkylene group having 2 or more carbon atoms, and at least one of hydrogen atoms in the alkylene group is substituted with an organic group; the alkylene group may contain two or more of the organic groups, and a plurality of the organic groups is not bonded to each other to form a ring structure; and * represents a bonding position.

2. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the ring structure formed by the mutual bonding of at least two of R 1 to R 3 is a monocyclic cycloalkyl group.

3. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the organic group is an alkyl group.

4. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 2 , wherein the organic group is an alkyl groups.

5. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein at least two of hydrogen atoms in the alkylene group are substituted with the organic group.

6. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 2 , wherein at least two of hydrogen atoms in the alkylene group are substituted with the organic group.

7. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 3 , wherein at least two of hydrogen atoms in the alkylene group are substituted with the organic group.

8. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 4 , wherein at least two of hydrogen atoms in the alkylene group are substituted with the organic group.

9. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 5 , wherein the organic group is bonded to the same carbon atom in the alkylene group.

10. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 6 , wherein the organic group is bonded to the same carbon atom in the alkylene group.

11. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 7 , wherein the organic group is bonded to the same carbon atom in the alkylene group.

12. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 8 , wherein the organic group is bonded to the same carbon atom in the alkylene group.

13. A pattern forming method comprising at least:
(a) forming an actinic ray-sensitive or radiation-sensitive resin composition film on a substrate using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ;
(b) irradiating the film with actinic ray or radiation; and
(c) developing the film irradiated with actinic ray or radiation using a developer.

14. The pattern forming method according to claim 13 , wherein the developer is a developer including an organic solvent.

15. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 13 .

Assignees

• Fujifilm Corp

Inventors

• KOJIMA Masafumi
• Goto Akiyoshi
• Shibuya Akinori
• Kato Keita
• Yamamoto Kei

Classifications

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/325

  Non-aqueous compositions · CPC title

• G03F7/2041

  in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title

• G03F7/11

  having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title

• G03F7/0046

  with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title