Laser processing method and laser processing apparatus

Patent metadata

Field	Value
Publication number	US-9837315-B2
Application number	US-201414587677-A
Country	US
Kind code	B2
Filing date	Dec 31, 2014
Priority date	Sep 13, 2000
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

First claim

What is claimed is:

1. A method of manufacturing a semiconductor device comprising the steps of:
irradiating a substrate with a pulsed laser light at a converging point within the substrate, so that the converging point of the pulsed laser light is positioned within the substrate to form a modified spot within the substrate at the converging point; and
performing the irradiating step at multiple locations along each of a plurality of intersecting cutting lines along which the substrate is to be cut to form a plurality of modified spots within the substrate at converging points of the pulsed laser light, respectively, without melting a pulsed laser light incident surface of the substrate, the modified spots each having a modified region, the modified spots being formed intermittently along each of the plurality of intersecting cutting lines, the modified spots are formed in the substrate only by the laser irradiation converging within the substrate; and
cutting the substrate into parts by dry processing along the plurality of intersecting cutting lines by growing cracks from the modified spots to grow towards a front and a back surface of the substrate, without causing modifications to be formed in the front and back surfaces of the substrate other than the cracks cutting the substrate into parts.

2. The method according to claim 1 , wherein the step of cutting the substrate into the parts by the dry processing along the plurality of intersecting cutting lines includes deforming a sheet supporting the substrate and applying stress to the substrate to cut and separate the substrate on the sheet into the parts to obtain at least one manufactured semiconductor device.

3. The method according to claim 1 , wherein the plurality of intersecting cutting lines include first cutting lines and second cutting lines, the second cutting lines cross the first cutting lines, and after formation of the modified regions has been performed, the substrate is cut into at least one piece having a chip shape.

4. The method according to claim 2 , wherein the first lines are arranged in parallel to each other and the second lines are arranged in parallel to each other so that the first and second lines form a grid-like pattern.

5. The method according to claim 1 , wherein the modified spots comprise cracks.

6. The method according to claim 1 , wherein the modified spots comprise a refractive index changing region.

7. The method according to claim 1 , wherein the substrate is made of mono-crystal material.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Fukuyo Fumitsugu
• Fukumitsu Kenshi
• Uchiyama Naoki
• Wakuda Toshimitsu

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• C03B33/023

  the sheet {or ribbon} being in a horizontal position · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title