Header assembly for a pressure sensor

Patent metadata

Field	Value
Publication number	US-9835512-B2
Application number	US-201715399806-A
Country	US
Kind code	B2
Filing date	Jan 6, 2017
Priority date	Oct 11, 2013
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.

First claim

What is claimed is:

1. A system, comprising:
a header;
a single-piece ceramic header insert coupled to the header, the header insert comprising:
a hollow protrusion having a metalized inner surface; and
a base having a metalized outer surface; and

a header pin disposed in the hollow protrusion;
wherein the metalized inner surface of the hollow protrusion is sealed to header pin, and wherein at least a portion of the metalized outer surface of the base is sealed to the header.

2. The system of claim 1 , wherein the header insert is composed of one contiguous material.

3. The system of claim 1 , wherein the header insert includes an aperture configured for accepting a pressure sensor, and wherein the header pin is configured for electrically coupling with the pressure sensor.

4. The system of claim 3 , wherein the base includes an aperture configured to allow a pressure to be received by the pressure sensor.

5. The system of claim 1 , wherein the header comprises a metallic material.

6. The system of claim 1 , wherein the header insert includes a groove for a ball bond wire used to couple a contact of a pressure sensor to the header pin.

7. The system of claim 1 , wherein the seal comprises a braze.

8. The system of claim 1 , wherein an area of the seal formed between the header and the base is at least a surface area of an outer surface of the hollow protrusion of the header insert.

9. The header insert of claim 1 , wherein a shape of the hollow protrusion is a cylinder.

10. A method, comprising:
metalizing an inner surface of a hollow protrusion of a single-piece ceramic header insert to form a metalized inner surface;
metalizing a base of the header insert to form a metalized outer surface;
placing the header insert in a header;
placing a header pin in the hollow protrusion;
forming a first seal between the header pin and the metalized inner surface of the hollow protrusion; and
forming a second seal between the metalized outer surface of the base and the header.

11. The method of claim 10 , wherein the header insert is composed of one contiguous material.

12. The method of claim 10 , wherein the header is composed of a metallic material.

13. The method of claim 10 , further comprising placing a pressure sensor in an aperture of the header insert.

14. The method of claim 13 , further comprising electrically coupling the pressure sensor to the header pin.

15. The method of claim 14 , further comprising placing a ball bond wire in a groove of the header insert.

16. The method of claim 15 , further comprising coupling a contact of the pressure sensor to the ball bond.

17. The method of claim 15 , further comprising coupling the header pin to the ball bond wire.

18. The method of claim 10 , wherein an area of the seal formed between the header and the base is at least a surface area of an outer surface of the hollow protrusion of the header insert.

19. The method of claim 10 , wherein forming the seal comprises a single process step.

20. An apparatus, comprising:
a single-piece ceramic header insert configured to couple to a header, the header insert having a base with a metalized outer surface configured to seal with the header, the header insert further having one or more a hollow protrusions, each of the one or more hollow protrusions having a metalized inner surface configured to receive and seal with a corresponding header pin.

Assignees

• Kulite Semiconductor Products Inc

Inventors

• Martin Richard
• Derosa Louis
• Gardner Robert

Classifications

• G01L19/0069 Primary

  from the sensor to its support · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K2101/38

  Conductors · CPC title

• G01L19/0084

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title

• B23K1/0008

  specially adapted for particular articles or work · CPC title