Package-in-package semiconductor sensor device

Patent metadata

Field	Value
Publication number	US-9362479-B2
Application number	US-201414337225-A
Country	US
Kind code	B2
Filing date	Jul 22, 2014
Priority date	Jul 22, 2014
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.

First claim

The invention claimed is:

1. A semiconductor sensor device, comprising:
a device substrate;
a micro controller unit (MCU) die attached to the device substrate;
a pressure sensor package having a sensor substrate and a pressure sensor die electrically connected to the sensor substrate, the sensor substrate having a front side with the pressure sensor die attached thereto, a back side, and an opening from the front side to the back side, wherein the pressure sensor die is flip-chip mounted to the sensor substrate using conductive bumps, and the sensor device further comprises a pressure-sensitive gel covering the conductive bumps and the pressure sensor die, and at least partially filling the opening in the sensor substrate; and
a molding compound encapsulating the MCU die, the device substrate, and the pressure sensor package, the molding compound having an outer surface;
wherein the back side of the sensor substrate and the opening in the sensor substrate are exposed on the outer surface of the molding compound.

2. The sensor device of claim 1 , wherein:
the device substrate is a lead frame comprising a die paddle and at least one lead;
the MCU die is attached to the die paddle by an adhesive layer; and
the MCU die is electrically connected to the at least one lead with at least one bond wire.

3. The sensor device of claim 1 , wherein the pressure sensor die is attached to the MCU using a layer of adhesive.

4. The sensor device of claim 1 , further comprising:
another sensor die attached to the device substrate and electrically connected to the MCU with additional bond wires.

5. A semiconductor sensor device comprising:
a device substrate;
a micro controller unit (MCU) die attached to the device substrate;
a pressure sensor package having a sensor substrate and a pressure sensor die electrically connected to the sensor substrate, the sensor substrate having a front side with the pressure sensor die attached thereto, a back side, and an opening from the front side to the back side; and
a molding compound encapsulating the MCU die, the device substrate, and the pressure sensor package, the molding compound having an outer surface,
wherein the back side of the sensor substrate and the opening in the sensor substrate are exposed on the outer surface of the molding compound, and wherein the sensor substrate comprises:
first and second insulating layers;
patterned traces disposed between the first and second insulating layer;
a first set of metal vias disposed in the first insulating layer and connecting to the patterned traces, the first set of metal vias having exposed ends on the front side of the sensor substrate; and
metal bumps on the exposed ends of the first set of metal vias, wherein the metal bumps electrically connect the pressure sensor die to exposed ends of the first set of metal vias on the sensor substrate.

6. The sensor device of claim 5 , wherein the sensor substrate further comprises:
a second set of vias disposed in the first and insulating layers and connecting to the patterned traces;
wherein a portion of the second insulating layer is absent, thereby exposing ends of the second set of vias to form substrate bond pads connected to the patterned traces, and
wherein the MCU die is electrically connected to the substrate bond pads on the exposed end portions of the second set of vias.

7. The sensor device of claim 6 , wherein a portion of the second insulating layer is absent thereby exposing a portion of the patterned traces and substrate bond pads connected to the patterned traces, and wherein the MCU die is electrically connected to the substrate bond pads on the sensor substrate.

Assignees

• Lo Wai Yew
• Freescale Semiconductor Inc

Inventors

• Lo Wai Yew

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title