Uses of condensation resins

Patent metadata

Field	Value
Publication number	US-9834676-B2
Application number	US-201414763984-A
Country	US
Kind code	B2
Filing date	Feb 14, 2014
Priority date	Feb 18, 2013
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

The present invention relates to new uses of condensation resins made from urea, formaldehyde, and CH-acidic aldehydes.

First claim

The invention claimed is:

1. A method for incorporating at least one additive(s) into a composition comprising at least one epoxide compound(s), comprising:
mixing the at least one additive with at least one condensation resin, wherein the at least one condensation resin comprises condensed units of formaldehyde, at least one urea, and at least one CH-acidic aldehyde, then
mixing the resulting mixture of the at least one condensation resin and the at least one additive(s) with the composition comprising at least one epoxide compound(s) and at least one of a curing agent and a catalyst to form a curable epoxide mixture,
wherein the curable epoxy mixture comprises from 1 to 20 wt % of the at least one additive, from 0.2 to 10 wt % of the at least one condensation resin, and 70 to 98.8 wt % of the at least one epoxide compound(s) where wt % is based on 100 wt % of the combined amounts of the at least one additive, the at least one condensation resin, and the at least one epoxide compound(s), and
wherein the at least one additive is selected from the group consisting of a pigment, a flame retardant, a flow assistant, a thixotropic assistant, a diluent, and a filler.

2. The method according to claim 1 , wherein the at least one epoxide compound(s) have 2 to 10 epoxide groups.

3. The method according to claim 1 , wherein the at least one epoxide compound(s) have a number-average molar weight (Mn) of less than 1000 g/mol.

4. The method according to claim 1 , wherein the at least one epoxide compound(s) are compounds having two aromatic or aliphatic six-membered rings or oligomers thereof.

5. The method according to claim 1 , wherein the at least one condensation resin has a number-average molar weight M n of 300 to less than 3000 g/mol and a weight-average molar weight M w of 500 to 2000.

6. The method according to claim 1 , wherein the at least one condensation resin has a number-average molar weight M n of 300 to less than 1000 g/mol and a weight-average molar weight M w of 500 to 2000.

7. The method according to claim 1 , wherein the at least one condensation resin has a hydroxyl number to DIN ISO 4629 of 5 to 150 mg KOH/g.

8. The method according to claim 1 , wherein the at least one condensation resin has a hydroxyl number to DIN ISO4629 of 50 to 120 mg KOH/g.

9. The method according to claim 1 , wherein the at least one condensation resin has a glass transition temperature T g by the DSC method (Differential Scanning calorimetry) to ASTM 3418/82 with a heating rate of 2.5° C./min of less than 70° C.

10. The method according to claim 1 , wherein the at least one condensation resin comprises condensed units of urea, formaldehyde, and isobutyraldehyde.

11. The method according to claim 1 , wherein the mixing of the at least one additive with the at least one condensation resin takes place in a stirring vessel, mixer, extruder, disperser, or kneader.

12. The method of claim 1 , wherein the at least one condensation resin comprises condensed units of formaldehyde, precisely one urea, and precisely one CH-acidic aldehyde.

13. The method of claim 1 , further comprising: curing the curable epoxide mixture to form a cured composition.

14. The method of claim 1 , wherein the curable epoxy mixture comprises from 2 to 15 wt % of the at least one additive, from 0.2 to 5 wt % of the at least one condensation resin, and 75 to 97.8 wt % of the at least one epoxide compound(s), where wt % is based on 100 wt % of the combined amounts of the at least one additive, the at least one condensation resin, and the at least one epoxide compound(s).

15. A curable epoxy composition comprising
at least one of a curing agent and a catalyst,
1 to 20 wt % of at least one additive,
0.2 to 10 wt % of at least one condensation resin, wherein the at least one condensation resin comprises condensed units of formaldehyde, at least one urea, and at least one CH-acidic aldehyde, and
70 to 98.8 wt % of at least one epoxide compound,
where wt % is based on 100 wt % of the combined amounts of the at least one additive, the at least one condensation resin, and the at least one epoxide compound(s), and
wherein the at least one additive is selected from the group consisting of a pigment, a flame retardant, a flow assistant, a thixotropic assistant, a diluent, and a filler.

16. The composition of claim 15 wherein the at least one condensation resin has a number-average molar weight M n of 300 to less than 3000 g/mol and a weight-average molar weight M w of 500 to 2000 g/mol.

17. The curable epoxy composition of claim 15 , comprising:
2 to 15 wt % of the at least one additive,
0.2 to 5 wt % of the at least one condensation resin, and
75 to 97.8 wt % of the at least one epoxide compound,
where wt % is based on 100 wt % of the combined amounts of the at least one additive, the at least one condensation resin, and the at least one epoxide compound(s).

Assignees

• Basf Se

Inventors

• Boerzsoenyi Gabor
• Yin Chunhong
• Crone Benedikt
• Yu Miran
• Scherr Guenter
• Menzel Klaus
• Weilacher Dieter

Classifications

• C08G12/12 Primary

  Ureas; Thioureas · CPC title

• C08L61/24

  with urea or thiourea · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08L75/02 Primary

  Polyureas · CPC title

• C09D17/002

  in organic medium (C09D17/003, C09D17/004 take precedence) · CPC title