Porous polymer material
US-9522358-B2 · Dec 20, 2016 · US
Curing compositions and methods of preparing
US9790313B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9790313-B2 |
| Application number | US-201514831586-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 20, 2015 |
| Priority date | Aug 21, 2014 |
| Publication date | Oct 17, 2017 |
| Grant date | Oct 17, 2017 |
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Abstract
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Disclosed are curing compositions for resin systems and in particular for phenolic resin systems and epoxy resin systems, to methods of preparing the curing compositions and to resin systems incorporating same. The curing compositions of the invention are the reaction product of an aldehyde with an amine in the presence of an aprotic solvent.
First claim
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We claim: 1. A curing composition for a resin system comprising a reaction product consisting essentially of: paraformaldehyde; melamine; and N-methylpyrrolidinone (NMP), and wherein the reaction product is an intermediate product having the structure: and wherein the melamine: paraformaldehyde mole ratio is from about 1:3 to about 1:8. 2. The curing composition of claim 1 , wherein the intermediate product is water soluble. 3. The curing composition of claim 1 wherein the intermediate product is a binder or a co-curative for a resin system. 4. The curing composition of claim 1 wherein the resin system is a thermoset resin system. 5. The curing composition of claim 1 wherein the resin system is an epoxy or a phenolic resin system. 6. The curing composition of claim 1 wherein the melamine: paraformaldehyde mole ratio is from about 1:3 to about 1:6. 7. The curing composition of claim 6 wherein the melamine: paraformaldehyde mole ratio is from about 1:3 to about 1:5. 8. A method for isolating the intermediate product of claim 1 comprising the step of adding an organic solvent to the reaction product, which organic solvent may or may not be an aprotic solvent, to precipitate the intermediate product out of solution. 9. The method of claim 8 further comprising the step of adding water to the intermediate product.
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Frequently asked questions
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- What does patent US9790313B2 cover?
- Disclosed are curing compositions for resin systems and in particular for phenolic resin systems and epoxy resin systems, to methods of preparing the curing compositions and to resin systems incorporating same. The curing compositions of the invention are the reaction product of an aldehyde with an amine in the presence of an aprotic solvent.
- Who is the assignee on this patent?
- Hexion Inc
- What technology area does this patent fall under?
- Primary CPC classification C08G12/32. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Oct 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).