Absorbing reflector for semiconductor processing chamber

Patent metadata

Field	Value
Publication number	US-9832816-B2
Application number	US-201414258410-A
Country	US
Kind code	B2
Filing date	Apr 22, 2014
Priority date	Jun 21, 2013
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.

First claim

We claim:

1. A reflector for a processing chamber, comprising:
a body having a top surface, a bottom surface opposing the top surface, a cooling channel formed in the body; and
a heat absorptive coating layer deposited over at least a portion of the bottom surface, wherein the heat absorptive coating layer comprises:
a primer layer comprising an epoxy material; and
a coating layer comprising a polyurethane material, wherein the reflector is located on an external portion of the processing chamber and the processing chamber comprises an upper dome and a lower dome defining an internal volume enclosing a substrate support.

2. The reflector of claim 1 , wherein the heat absorptive coating layer absorbs thermal radiation at a wavelength of 1 micron to 4 micron.

3. The reflector of claim 1 , wherein the heat absorptive coating layer has a thickness of about 0.03mm and about 0.1mm.

4. The reflector of claim 1 , further comprising:
an optical pyrometer positioned to emit a focal beam passing through the heat absorptive coating layer.

5. A reflector for a processing chamber, comprising:
a plate having a top surface, a bottom surface opposing the top surface, and one or more cooling channels defined between the top surface and the bottom surface; and
a heat absorptive coating layer deposited over at least a portion of the bottom surface of the plate, wherein the heat absorptive coating layer comprises a coating layer comprising a polyurethane material, wherein the reflector is located on an external portion of the processing chamber and the processing chamber comprises an upper dome and a lower dome defining an internal volume enclosing a substrate support.

6. The reflector of claim 5 , wherein the heat absorptive coating layer further comprising:
a primer layer disposed between the coating layer and the bottom surface, wherein the primer layer comprises an epoxy material.

7. The reflector of claim 5 , wherein the heat absorptive coating layer absorbs thermal radiation at a wavelength of 1 micron to 4 micron.

8. The reflector of claim 5 , wherein the one or more cooling channels are arranged in a general sinuous geometry.

9. The reflector of claim 1 , wherein the primer layer is disposed between the coating layer and the bottom surface.

10. The reflector of claim 1 , wherein the optical pyrometer is disposed within an adapter tube formed in the top surface of the body.

11. The reflector of claim 5 , further comprising a plurality of optical pyrometers disposed in the plate.

Assignees

• Applied Materials Inc

Inventors

• Lo Kin Pong
• Brillhart Paul
• Ramachandran Balasubramanian
• Kuppurao Satheesh
• Redfield Daniel
• Ranish Joseph M
• Mack James Francis
• Patalay Kailash Kiran
• Olsen Michael
• Feigel Eddie
• Halpin Richard
• Vetorino Brett

Classifications

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P95/90 Primary

  Thermal treatments, e.g. annealing or sintering · CPC title

• H05B3/0047 Primary

  for semiconductor manufacture · CPC title

• H01L21/67115

  Electricity · mapped topic