Structure and method to achieve compressively strained Si NS

Patent metadata

Field	Value
Publication number	US-9831323-B2
Application number	US-201615267134-A
Country	US
Kind code	B2
Filing date	Sep 15, 2016
Priority date	Mar 11, 2016
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A stack for a semiconductor device and a method for making the stack are disclosed. The stack includes a plurality of sacrificial layers in which each sacrificial layer has a first lattice parameter; and at least one channel layer that has a second lattice parameter in which the first lattice parameter is less than or equal to the second lattice parameter, and each channel layer is disposed between and in contact with two sacrificial layers and includes a compressive strain or a neutral strain based on a difference between the first lattice parameter and the second lattice parameter.

First claim

What is claimed is:

1. An epitaxial stack grown on an underlayer for a semiconductor device, the epitaxial stack comprising:
a plurality of sacrificial layers, each sacrificial layer comprising BeZnSe and having a first intrinsic lattice parameter; and
at least one channel layer comprising a material with a second intrinsic lattice parameter, the first intrinsic lattice parameter being less than or equal to the second intrinsic lattice parameter, and the at least one channel layer being disposed between and in contact with two sacrificial layers of the plurality of sacrificial layers and comprising a compressive strain or a neutral strain based on a difference between the first intrinsic lattice parameter and the second intrinsic lattice parameter.

2. The epitaxial stack according to claim 1 , further comprising:
a pair of recesses in the epitaxial stack, each recess extending from a top of the epitaxial stack to the underlayer; and
a source/drain structure in each recess, the at least one channel layer substantially comprising a compressive strain after the source/drain structure has been formed in each recess.

3. The epitaxial stack according to claim 1 , wherein the compressive strain in the at least one channel layer is further based on a layer thickness and a composition of the sacrificial layers and a layer thickness and a composition of the at least one channel layer.

4. The epitaxial stack according to claim 1 , wherein the sacrificial layers further comprise a combination of BeZnSe and SiGe:C, a combination of BeZnSe and SiC, or a combination of BeZnSe, SiGe:C and SiC, and
wherein the at least one channel layer comprises silicon.

5. The epitaxial stack according to claim 1 , wherein the at least one channel layer comprises a first end and a second end,
the epitaxial stack further comprising a source/drain structure disposed at and in contact with each of the first and second ends of the at least one channel layer.

6. The epitaxial stack according to claim 1 , wherein the at least one channel layer comprises a nanosheet.

7. The epitaxial stack according to claim 1 , wherein the at least one channel layer comprises a nanowire.

8. A stack for a semiconductor device, comprising:
an underlayer; and
an epitaxial stack of a plurality of sacrificial layers and at least one channel layer on the underlayer, a sacrificial layer of the plurality of sacrificial layers being in contact with the underlayer, each sacrificial layer material comprising BeZnSe and having a first intrinsic lattice parameter, the at least one channel layer comprising a material with a second intrinsic lattice parameter, the first intrinsic lattice parameter being smaller than or equal to the second intrinsic lattice parameter, and the at least one channel layer being disposed between and in contact with two sacrificial layers of the plurality of sacrificial layers and comprising a compressive strain or a neutral strain based on a difference between the first intrinsic lattice parameter and the second intrinsic lattice parameter.

9. The stack according to claim 8 , wherein the sacrificial layers further comprise a combination of BeZnSe and SiGe:C, a combination of BeZnSe and SiC, or a combination of BeZnSe, SiGe:C and SiC, and
wherein the at least one channel layer comprises silicon.

10. The stack according to claim 8 , wherein the at least one channel layer comprises a first end and a second end,
the stack further comprising a source/drain structure disposed at and in contact with each of the first and second ends of the at least one channel layer.

11. The stack according to claim 8 , wherein the at least one channel layer comprises a nanosheet.

12. The stack according to claim 8 , wherein the at least one channel layer comprises a nanowire.

13. A method to form a stack for a semiconductor device, the method comprising:
providing an underlayer; and
forming an epitaxial stack of a plurality of sacrificial layers and at least one channel layer on the underlayer, a sacrificial layer of the plurality of sacrificial layers being in contact with the underlayer, each sacrificial layer comprising BeZnSe and having a first intrinsic lattice parameter, the at least one channel layer comprising a second material with a second intrinsic lattice parameter, the first intrinsic lattice parameter being smaller than or equal to the second intrinsic lattice parameter, and the at least one channel layer being disposed between and in contact with two sacrificial layers of the plurality of sacrificial layers and comprising a compressive strain based on a difference between the first intrinsic lattice parameter and the second intrinsic lattice parameter.

14. The method according to claim 13 , further comprising:
forming a pair of recesses in the stack, each recess extending from a top of the stack to the underlayer; and
forming a source/drain structure in each recess, the at least one channel layer substantially comprising the compressively strain after the source/drain structure has been formed in each recess.

15. The method according to claim 13 , wherein the compressive strain in the at least one channel layer is further based on a layer thickness and a composition of the sacrificial layers and a layer thickness and a composition of the at least one channel layer.

16. The method according to claim 13 , wherein the sacrificial layers further comprise a combination of BeZnSe and SiGe:C, a combination of BeZnSe and SiC, or a combination of BeZnSe, SiGe:C and SiC, and
wherein the at least one channel layer comprises silicon.

17. The method according to claim 13 , further comprising:
forming a dummy gate structure on the stack before forming the pair of recesses, the dummy gate structure comprising a dummy gate and spacers on sidewalls of the dummy gate, and
wherein the pair of recesses are on opposite sides of the dummy gate structure.

18. The method according to claim 17 , further comprising:
removing the dummy gate after forming source/drain structures in each recess; and
removing the sacrificial layers of the stack after removing the dummy gate.

19. The method according to claim 18 , further comprising forming a gate electrode in a space formed by removing the sacrificial layers of the stack and in a space formed by removing the dummy gate.

20. The method according to claim 13 , wherein forming the epitaxial stack of the plurality of sacrificial layers and the at least one channel layer on the underlayer comprises forming the plurality of sacrificial layers and the at least one channel layer in an alternating sequence on the underlayer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kittl Jorge A
• Hegde Ganesh
• Bowen Robert Christopher
• Obradovic Borna J
• Rodder Mark S

Classifications

• H10P95/70

  Chemical treatments · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10P50/20

  Dry etching; Plasma etching; Reactive-ion etching · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title