Interposer substrate and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9831165-B2
Application number	US-201414547743-A
Country	US
Kind code	B2
Filing date	Nov 19, 2014
Priority date	Aug 29, 2014
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.

First claim

What is claimed is:

1. An interposer substrate, comprising:
a first insulating layer having a first surface and a second surface opposing to the first surface;
a first wiring layer formed on the first surface of the first insulating layer wherein the first wiring layer has a surface lower than the first surface of the first insulating layer;
a plurality of conductive pillars formed in the first insulating layer and on the first wiring layer, and connected to the second surface of the first insulating layer;
a second wiring layer formed on the second surface of the first insulating layer and electrically connected with the conductive pillars; and
a second insulating layer formed on the second surface of the first insulating layer and the second wiring layer,
wherein a portion of a surface of the second wiring layer is exposed from the second insulating layer, and the surface of the second wiring layer is flush with or lower than a surface of the second insulating layer and free from being in contact with the second surface of the first insulating layer.

2. The interposer substrate of claim 1 , wherein the first insulating layer is made of a molding compound, a primer, or a dielectric material.

3. The interposer substrate of claim 1 , wherein the conductive pillars have a terminal surface flush with the second surface of the first insulating layer.

4. The interposer substrate of claim 1 , wherein the second wiring layer is a plurality of solder ball pads.

5. The interposer substrate of claim 1 , wherein the second insulating layer is made of a molding compound, a primer, or a dielectric material.

6. The interposer substrate of claim 1 , further comprising a supporting structure disposed on the first surface of the first insulating layer.

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Hsu Che-Wei
• Hsu Shih-Ping
• Liu Chih-Wen

Classifications

• H10W70/695

  Organic materials · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W70/635 Primary

  Through-vias · CPC title

• H05K2203/0152

  Temporary metallic carrier, e.g. for transferring material · CPC title