Method for estimating shape before shrink and CD-SEM apparatus

Patent metadata

Field	Value
Publication number	US-9830524-B2
Application number	US-201214239803-A
Country	US
Kind code	B2
Filing date	May 24, 2012
Priority date	Aug 22, 2011
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

In the present invention, at the time of measuring, using a CD-SEM, a length of a resist that shrinks when irradiated with an electron beam, in order to highly accurately estimate a shape and dimensions of the resist before shrink, a shrink database with respect to various patterns is previously prepared, said shrink database containing cross-sectional shape data obtained prior to electron beam irradiation, a cross-sectional shape data group and a CD-SEM image data group, which are obtained under various electron beam irradiation conditions, and models based on such data and data groups, and a CD-SEM image of a resist pattern to be measured is obtained (S 102 ), then, the CD-SEM image and data in the shrink database are compared with each other (S 103 ), and the shape and dimensions of the pattern before the shrink are estimated and outputted (S 104 ).

First claim

The invention claimed is:

1. A method for estimating shape before shrink of a pattern used for measuring a shape and a dimension of the pattern formed of a substance which shrinks under an electron beam irradiation using a CD-SEM, the method comprising:
preparing a shrink database comprising a data group and a model based on said data group,
wherein the data group comprises cross-sectional shape data of the pattern formed of said substance before the electron beam irradiation, a cross-sectional shape data group obtained under various electron beam irradiation conditions, and a CD-SEM image data group obtained under various electron beam irradiation conditions,
wherein the model comprises a shrink model generated by using the cross-sectional shape data of the pattern formed of said substance before the electron beam irradiation and the cross-sectional shape data group obtained under various electron beam irradiation conditions, and a correlation model between a CD-SEM image feature amount and a cross-sectional shape generated by using the cross-sectional shape data group obtained under various electron beam irradiation conditions and the CD-SEM image data group obtained under various electron beam irradiation conditions, and
wherein the cross-sectional shape data comprises a plurality of resist widths each associated with a corresponding different resist height so as to form a 3D cross-sectional pattern used for measuring;
acquiring a CD-SEM image of a 3D cross-sectional pattern to be measured formed of said substance, wherein the 3D cross-sectional pattern is based on the plurality of resist widths and heights; and
estimating and outputting a shape and a dimension of the 3D cross-sectional pattern to be measured before shrink using the CD-SEM image and data of the shrink database.

2. The method for estimating shape before shrink according to claim 1 , wherein the shrink database includes data of the patterns with various shapes, which are formed of various substances.

3. The method for estimating shape before shrink according to claim 2 ,
wherein the cross-sectional shape data before electron beam irradiation and the cross-sectional shape data group acquired under the various electron beam irradiation conditions which constitute the shrink database are obtained by processing the pattern into a cross-section sample through a converging ion beam processing method, and observing the cross-section sample with a transmission electron microscope.

4. The method for estimating shape before shrink according to claim 3 ,
wherein a boundary film formed of a substance with larger atomic number than that of the substance for forming the pattern is further applied on a surface of the pattern, and a protection film is applied on the boundary film before the pattern is processed through the converging ion beam processing method.

5. The method for estimating shape before shrink according to claim 3 , wherein the cross-section sample includes an electron beam irradiation region and an electron beam unirradiation region.

6. A CD-SEM apparatus comprising:
an electron beam source;
a sample stage on which a sample to be measured is disposed;
an electron optical system for irradiating the sample on the sample stage with an electron emitted from the electron beam source;
a control process unit for executing an image processing based on a secondary electron discharged from the sample; and
a shrink database which comprises
cross-sectional shape data of a pattern before electron beam irradiation, the pattern formed of a substance which shrinks under the electron beam irradiation;
a cross-sectional shape data group obtained under various electron beam irradiation conditions;
a CD-SEM image data group obtained under various electron beam irradiation conditions;
a shrink model generated using said cross-sectional shape data group using the cross-sectional shape data of the pattern formed of said substance before the electron beam irradiation and the cross-sectional shape data group obtained under various electron beam irradiation conditions; and
a correlation model which is generated using the cross-sectional shape data group obtained under various electron beam irradiation conditions and the CD-SEM image data group obtained under various electron beam irradiation conditions and which models a relationship between a CD-SEM image feature amount and a cross-sectional shape for estimating the shape of the pattern formed of the substance before shrink,
wherein the cross-sectional shape data comprises a plurality of resist widths each associated with a corresponding different resist height, said plurality of resist widths and heights being used to form said pattern as a 3D pattern formed of said substance before the electron beam irradiation.

7. The CD-SEM apparatus according to claim 6 , wherein the shrink database includes data of the patterns with various shapes, which are formed of various substances.

8. The CD-SEM apparatus according to claim 7 ,
wherein the cross-sectional shape data before electron beam irradiation and the cross-sectional shape data group acquired under the various electron beam irradiation conditions which constitute the shrink database are obtained by processing the pattern into a cross-section sample through a converging ion beam processing method, and observing the cross-section sample with a transmission electron microscope.

9. The CD-SEM apparatus according to claim 8 ,
wherein a boundary film formed of a substance with larger atomic number than that of the substance for forming the pattern is further applied on a surface of the pattern, and a protection film is applied on the boundary film before the pattern is processed through the converging ion beam processing method.

10. The CD-SEM apparatus according to claim 9 , wherein the shrink database is included in the control process unit.

11. The CD-SEM apparatus according to claim 9 , further comprising a display unit connected to the control process unit for displaying the cross-sectional shapes before and after shrink of a measured pattern formed of the substance which shrinks under electron beam irradiation on the measured sample.

12. The CD-SEM apparatus according to claim 6 , wherein each of said plurality of resist widths is associated with one of at least three resist heights comprising a first width at a height of an upper part of a resist pattern, a second width at a height of an intermediate part of the resist pattern, and a third width at a height of a lower part of the resist pattern.

13. The method for estimating shape before shrink according to claim 1 ,
wherein each of said plurality of resist widths is associated with one of at least three resist heights comprising a first width at a height of an upper part of a resist pattern, a second width at a height of an intermediate part of the resist pattern, and a third width at a height of a lower part of the resist pattern.

Assignees

• Sekiguchi Tomoko
• Ohashi Takeyoshi
• Tanaka Junichi
• Cheng Zhaohui
• Tsuneta Ruriko
• Kawada Hiroki
• Hitomi Seiko
• Hitachi High Tech Corp

Inventors

• Sekiguchi Tomoko
• Ohashi Takeyoshi
• Tanaka Junichi
• Cheng Zhaohui
• Tsuneta Ruriko
• Kawada Hiroki
• Hitomi Seiko

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H01J2237/2816

  Length · CPC title

• H01L22/12

  Electricity · mapped topic

• H01J2237/31796

  affecting resists · CPC title

• H01L2924/0002

  Electricity · mapped topic