Low-temperature cooling apparatus and superconducting quantum interference device sensor module

Patent metadata

Field	Value
Publication number	US-9829546-B2
Application number	US-201514692294-A
Country	US
Kind code	B2
Filing date	Apr 21, 2015
Priority date	Oct 29, 2012
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

Provided are a low-temperature cooling apparatus and a superconducting quantum interference device (SQUID) sensor module. The low-temperature cooling apparatus includes an outer container; an inner container disposed inside the outer container, the inner container including a neck portion having a first diameter and a body portion having a second diameter greater than the first diameter; an insert inserted into the neck portion of the inner container; and a plurality of SQUID sensor modules inserted into the body portion of the inner container. Each of the SQUID sensor modules is in the form of a fan-shaped pillar and is fixedly coupled with an inner bottom plate of the inner container.

First claim

What is claimed is:

1. A low-temperature cooling apparatus comprising:
an outer container;
an inner container disposed inside the outer container, the inner container including a neck portion having a first diameter and a body portion having a second diameter greater than the first diameter;
an insert inserted into the neck portion of the inner container; and
a plurality of SQUID sensor modules inserted into the body portion of the inner container
wherein each of the plurality of SQUID sensor modules is in the form of a circular-sector pillar and is fixedly coupled with an inner bottom plate of the inner container;
wherein each of the plurality of SQUID sensor modules comprises:
an upper sensor-coupling plate having a through-hole;
a lower sensor-coupling plate including a protrusion disposed to be aligned with the through-hole;
an upper printed circuit board disposed below the upper sensor-coupling plate, the upper printed circuit board having a printed circuit board through-hole aligned with the through-hole; and
a SQUID sensor;
wherein one end of each SQUID sensor is inserted into the through-hole and the printed circuit board through-hole; and
wherein another end of each SQUID sensor has a groove that is disposed on the protrusion of the lower sensor-coupling plate.

2. The low-temperature cooling apparatus as set forth in claim 1 , wherein the inner bottom plate includes a partition such that the SQUID sensor module is inserted and aligned with the inner bottom plate.

3. The low-temperature cooling apparatus as set forth in claim 1 , wherein the insert further comprises an intermediate connection block, and
wherein an interconnection of the SQUID sensor module is electrically connected to the intermediate connection block.

4. The low-temperature cooling apparatus as set forth in claim 1 , wherein the upper sensor coupling plate further has an auxiliary through-hole.

5. The low-temperature cooling apparatus as set forth in claim 1 , wherein the upper sensor coupling plate further has a trench formed on its bottom surface.

6. The low-temperature cooling apparatus as set forth in claim 1 , wherein the SQUID sensor module further comprises a module coupling pillar coupled with the inner bottom plate through a fan-shaped central region.

7. The low-temperature cooling apparatus as set forth in claim 1 , wherein the SQUID sensor comprises:
a bobbin on which a pick-up coil is wound;
a SQUID mounted on the bobbin and electrically connected to the pick-up coil; and
a printed circuit board electrically connected to the SQUID and fixed to the bobbin.

8. The low-temperature cooling apparatus as set forth in claim 7 , wherein the bobbin comprises:
a cylindrical body portion;
a cut-out portion connected to the body portion and cut out such that its side surface forms a plane;
a square-pillar portion connected to the cut-out portion, the square-pillar portion having a square section; and
a cylindrical portion extending from the center of the square-pillar portion,
wherein the groove is formed on a bottom surface of the body portion.

9. The low-temperature cooling apparatus as set forth in claim 1 , wherein each of the SQUID sensor modules comprises:
a copper-manganese-nickel alloy wire electrically connected to the SQUID sensor module;
a plastic braided wire to protect the copper-manganese-nickel alloy wire; and
a connection connector connected to the copper-manganese-nickel alloy wire.

10. A SQUID sensor module inserted into a low-temperature cooling apparatus including an inner container and an outer container, the SQUID sensor module comprising:
an upper sensor coupling plate having a coupling groove and a through-hole through which a coupling tool is coupled;
a lower sensor coupling plate including a protrusion disposed to be aligned with the through-hole;
an upper printed circuit board disposed below the upper sensor coupling plate, the upper printed circuit board having a printed circuit board through-hole aligned with the through-hole; and
a SQUID sensor having one end inserted into the through-hole and the printed circuit board through-hole and the other end having a groove disposed on the protrusion.

11. The SQUID sensor module as set forth in claim 10 , wherein the upper sensor coupling plate further has an auxiliary through-hole through which coolant bubbles pass.

12. The SQUID sensor module as set forth in claim 10 , wherein the upper sensor coupling plate further has a trench formed on its bottom surface, and
wherein interconnections of the SQUID sensor module are buried in the trench.

13. The SQUID sensor module as set forth in claim 10 , further comprising:
a module coupling pillar coupled with a bottom plate of the inner container through the SQUID sensor module.

14. The SQUID sensor module as set forth in claim 10 , wherein the SQUID sensor comprises:
a bobbin on which a pick-up coil is wound;
a SQUID mounted on the bobbin and electrically connected to the pick-up coil; and
a printed circuit board electrically connected to the SQUID and fixed to the bobbin.

15. The SQUID sensor module as set forth in claim 14 , wherein the bobbin comprises:
a cylindrical body portion;
a cut-out portion connected to the body portion and cut out such that its side surface forms a plane;
a square-pillar portion connected to the cut-out portion, the square-pillar portion having a square section; and
a cylindrical portion extending from the center of the square-pillar portion,
wherein the groove is formed on a bottom surface of the body portion.

16. The SQUID sensor module as set forth in claim 10 , wherein the SQUID sensor module further comprises:
a copper-manganese-nickel alloy wire electrically connected to the SQUID sensor module;
a plastic braided wire to protect the copper-manganese-nickel alloy wire; and
a connection connector connected to the copper-manganese-nickel alloy wire.

Assignees

• Korea Res Inst Standards & Sci

Inventors

• Yu Kwon-Kyu
• Lee Yong-Ho
• Kwon Hyukchan
• Kim Jin-Mok
• Kim Kiwoong
• Lee Sang-Kil

Classifications

• G01R33/0082

  Compensation, e.g. compensating for temperature changes · CPC title

• A61B5/05

  Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves (measuring movement of the entire body or parts thereof A61B5/11; detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof A61B5/24) · CPC title

• G01R33/0047

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title

• A61B5/04005

  Human Necessities · mapped topic

• G01R33/0354 Primary

  SQUIDS · CPC title