Microelectromechanical sensor module and corresponding production method

Patent metadata

Field	Value
Publication number	US-9829357-B2
Application number	US-201113992136-A
Country	US
Kind code	B2
Filing date	Oct 14, 2011
Priority date	Dec 7, 2010
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

First claim

The invention claimed is:

1. A microelectromechanical sensor module comprising:
a sensing mechanism configured to measure one or more of an acceleration, a pressure, and an air humidity;
a control mechanism configured to control the sensor module;
a power supply mechanism configured to supply power to the sensor module; and
a transmission mechanism configured to transmit signals from the sensing mechanism,
wherein at least three of the mechanisms are integrated at the chip level with each of the at least three mechanisms in a respective chip, and
wherein at least two of the mechanisms are arranged in a first chip of the respective chips.

2. The sensor module as claimed in claim 1 , wherein all of the mechanisms are integrated at the chip level.

3. The sensor module as claimed in claim 1 , wherein the power supply mechanism includes one or more of a battery and an environment energy converter.

4. The sensor module as claimed in claim 3 , wherein the battery is a thin film battery and the environment energy converter is a solar cell.

5. The sensor module as claimed in claim 4 , wherein the solar cell comprises a collector interconnection system configured as the transmission mechanism.

6. The sensor module as claimed in claim 5 , wherein the collector interconnection system is configured as an antenna.

7. The sensor module as claimed in claim 1 , wherein the transmission mechanism includes one or more of a radio frequency interface and an antenna.

8. The sensor module as claimed in claim 1 , further comprising vias configured to make contact between the chips and/or between the chips and a printed circuit board.

9. The sensor module as claimed in claim 8 , wherein the vias are arranged at the edge of the respective chip and at least some of the vias are designed as an antenna.

10. A method for producing a microelectromechanical sensor module, comprising:
arranging a sensing mechanism on the sensor module, the sensing mechanism being configured to measure one or more an acceleration, a pressure, and an air humidity;
arranging a control mechanism on the sensor module, the control mechanism being configured to control the sensing mechanism;
arranging a power supply mechanism on the sensor module, the power supply mechanism being configured to supply power to the sensor module; and
arranging a transmission mechanism on the sensor module, the transmission mechanism being configured to transmit signals from the sensing mechanism,
wherein at least three of the mechanisms are arranged such that they are integrated at the chip level with each of the at least three mechanisms in a respective chip, and
wherein at least two of the mechanisms are arranged in a first chip of the respective chips.

Assignees

• Pirk Tjalf
• Wagner Thomas
• Feyh Ando
• Bischopink Georg
• Franke Axel
• Bosch Gmbh Robert

Inventors

• Pirk Tjalf
• Wagner Thomas
• Feyh Ando
• Bischopink Georg
• Franke Axel

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/879

  Bump connectors and bond wires · CPC title