Light source module, display panel, and display apparatus including the same

Patent metadata

Field	Value
Publication number	US-9825014-B2
Application number	US-201615226209-A
Country	US
Kind code	B2
Filing date	Aug 2, 2016
Priority date	Nov 19, 2015
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

First claim

What is claimed is:

1. A light source module, comprising:
a circuit board including at least one chip mounting region, the at least one chip mounting region including at least one connection pad;
at least one alignment component on the at least one chip mounting region, the at least one alignment component including a convex shape; and
at least one light emitting diode (LED) chip on the at least one chip mounting region, the at least one LED chip including at least one electrode, the at least one electrode configured to be electrically connected to the at least one connection pad of the at least one chip mounting region, the at least one LED chip being coupled to at least one alignment component of the at least one chip mounting region, the at least one LED chip includes at least one alignment recess, the at least one alignment recess being configured to be coupled to the at least one alignment component of the at least one chip mounting region.

2. The light source module of claim 1 , wherein alignment components are on respective edges of the at least one chip mounting region.

3. The light source module of claim 1 , wherein,
the at least one LED chip includes,
a light transmitting substrate, and
a semiconductor stack on the light transmitting substrate, and

the at least one alignment recess extends from points on edges of the light transmitting substrate of the at least one LED chip to points on edges of the light transmitting substrate of the at least one LED chip adjacent thereto in the semiconductor stack of the at least one LED chip.

4. The light source module of claim 1 , wherein the at least one LED chip further includes at least one alignment pad on the at least one alignment recess.

5. The light source module of claim 4 , wherein at least one of the at least one alignment component and the at least one alignment pad includes a magnetic body.

6. The light source module of claim 1 , wherein at least one of the at least one connection pad and the at least one electrode includes a magnetic body.

7. The light source module of claim 1 , further comprising:
a reflective guide layer on the circuit board and surrounding the at least one LED chip.

8. A light emitting diode (LED) display panel, comprising:
a circuit board including a plurality of pixel regions, each pixel region of the plurality of pixel regions including a plurality of chip mounting regions, each chip mounting region of the plurality of chip mounting regions including at least one connection pad;
at least one alignment component on each chip mounting region of the plurality of chip mounting regions, the at least one alignment component including a convex shape or a concave shape; and
a plurality of LED chips on the plurality of chip mounting regions, respectively, each LED chip of the plurality of LED chips including,
at least one electrode configured to be electrically connected to the at least one connection pad of each chip mounting region of the plurality of chip mounting regions, and
an alignment structure configured to be coupled to the at least one alignment component of each chip mounting region of the plurality of chip mounting regions.

9. The LED display panel of claim 8 , wherein,
the at least one alignment component on each chip mounting region of the plurality of chip mounting regions includes at least one alignment post structure on at least one edge of the chip mounting region of the plurality of chip mounting regions, and
each LED chip of the plurality of LED chips includes at least one alignment recess configured to be coupled to at least one alignment post structure of the plurality of chip mounting regions, respectively.

10. The LED display panel of claim 9 , wherein,
each LED chip of the plurality of LED chips includes,
a light transmitting substrate, and
a semiconductor stack on the light transmitting substrate, and

the at least one alignment recess extends from points on edges of the light transmitting substrate of the LED chip of the plurality of LED chips to points on edges of the light transmitting substrate of an adjacent LED chip of the plurality of LED chips in the semiconductor stack of the LED chip of the plurality of LED chips.

11. The LED display panel of claim 9 , wherein,
each LED chip of the plurality of LED chips further includes at least one alignment pad on the at least one alignment recess, and
at least one alignment component on each chip mounting region of the plurality of chip mounting regions and the at least one alignment pad of each LED chip of the plurality of LED chips includes a magnetic body.

12. The LED display panel of claim 8 , wherein at least one element of the at least one connection pad and the at least one electrode includes a magnetic body.

13. The LED display panel of claim 8 , wherein the at least one electrode includes at least one conductive magnetic body layer.

14. The LED display panel of claim 8 , wherein,
the each LED chip of the plurality of LED chips includes a first surface, and each LED chip of the plurality of LED chips is configured to be on the circuit board such that the first surface of the LED chip of the plurality of LED chips is a proximate surface of the LED chip of the plurality of LED chips, relative to the circuit board;
the at least one connection pad includes a first connection pad and a second connection pad;
the at least one electrode is on the first surface; and
the at least one electrode includes a first electrode and a second electrode, the first electrode and the second electrode being configured to be connected to the first connection pad and the second connection pad, respectively.

15. The LED display panel of claim 8 , wherein,
the each LED chip of the plurality of LED chips includes a first surface, and each LED chip of the plurality of LED chips is configured to be on the circuit board such that the first surface of the LED chip of the plurality of LED chips is a proximate surface of the LED chip of the plurality of LED chips, relative to the circuit board;
each LED chip of the plurality of LED chips includes a second surface, the second surface being an opposing surface, relative to the first surface;
the at least one electrode includes a first electrode on the first surface; and
each LED chip of the plurality of LED chips further includes a second electrode, the second electrode being on the second surface.

16. The LED display panel of claim 15 , further comprising:
an electrode wiring layer configured to interconnect second electrodes of each LED chip of the plurality of LED chips.

17. A light emitting diode (LED) chip, comprising:
a light transmitting substrate;
a semiconductor stack on the light transmitting substrate; and
at least one electrode on at least a portion of the semiconductor stack, the at least one electrode configured to couple with at least one connection pad of a circuit board to form a complementary fit, the circuit board being separate from the LED chip, such that
a sidewall of the at least one electrode is in flush contact with a sidewall of the at least one connection pad, and
at least a portion of the at least one electrode is co-planar with at least one portion of the at least one connection pad.

18. The LED chip of claim 17 , wherein the at least one electrode includes a magnetic body.

19. The LED chip of claim 17 , wherein the at least one electrode includes at least one conductive magnetic body layer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Cha Nam Goo
• Kim Yong Ii
• Lim Wan Tae

Classifications

• G09F9/33

  being semiconductor devices, e.g. diodes · CPC title

• H05K2203/168

  Wrong mounting prevention · CPC title

• H05K2203/104

  Using magnetic force, e.g. to align particles or for a temporary connection during processing · CPC title

• H05K2201/209

  Auto-mechanical connection between a component and a PCB or between two PCBs · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title