Circuit substrate and electronic device
US-2024023241-A1 · Jan 18, 2024 · US
Chip resistor and mounting structure thereof
US2016196902A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016196902-A1 |
| Application number | US-201615069167-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 14, 2016 |
| Priority date | Jul 17, 2013 |
| Publication date | Jul 7, 2016 |
| Grant date | — |
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Abstract
Official abstract text for this publication.
A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.
First claim
Opening claim text (preview).
1 - 33 . (canceled) 34 . A method of making a chip resistor, the method comprising the steps of: forming an insulating layer on an obverse surface of a resistor board; forming an electroconductive underlying layer on the obverse surface of the resistor board in a manner such that the underlying layer covers a part of the insulating layer; forming a plating layer on the obverse surface of the resistor board in a manner such that the plating layer covers the underlying l…
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- H01C1/012Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2016196902A1 cover?
- A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second el…
- Who is the assignee on this patent?
- Rohm Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01C1/012. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jul 07 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).