Method for manufacturing heat-resistant composite material

US9822445B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9822445-B2
Application numberUS-201514621128-A
CountryUS
Kind codeB2
Filing dateFeb 12, 2015
Priority dateAug 17, 2012
Publication dateNov 21, 2017
Grant dateNov 21, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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By using chemical vapor deposition or chemical vapor infiltration, silicon carbide is deposited on a preform 100 accommodated in a reaction furnace 11 for film formation, and the amount of additive gas added to raw material gas and carrier gas to be supplied to the reactive furnace 11 is used to control the growth rate and filling uniformity at film formation of silicon carbide. When the film formation of silicon carbide follows a first-order reaction, the amount of added additive gas is used to control the sticking probability of the film-forming species. When the film formation of silicon carbide follows a Langmuir-Hinshelwood rate formula, the amount of added additive gas is used to make a control so that a zero-order reaction region of the Langmuir-Hinshelwood rate formula is used.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a heat-resistant composite material, which uses chemical vapor deposition or chemical vapor infiltration to cause raw material gas and carrier gas to flow in a reaction furnace accommodating a base material having a microstructure and deposit silicon carbide on the base material for film formation, the method comprising: determining, according to a film-forming species, whether the film formation follows a first-order reaction or a Langmuir-Hinshelwood rate formula; further adding additive gas to the raw material gas and carrier gas, the raw material gas including silicon and carbon; and adjusting the amount of the added additive gas to control growth rate and filling uniformity at the film formation of silicon carbide, by controlling sticking probability of the film-forming species to the base material for the film formation following the first-order reaction, or by controlling so that a zero-order reaction region of the Langmuir-Hinshelwood rate formula is used for the film formation following the Langmuir-Hinshelwood rate formula, wherein the additive gas includes at least one of hydrochloride, methane chloride, and hydrocarbon gas, and using a flow rate of the raw material gas as a reference, a flow rate of hydrochloride relative to the flow rate of the raw material gas is 0.5 or more times the flow rate of the raw material gas, a flow rate of methane chloride relative to the flow rate of the raw material gas is 0.0081 or more times the flow rate of the raw material gas, or a flow rate of hydrocarbon gas relative to the flow rate of the raw material gas is 0.13 or more times the flow rate of the raw material gas. 2. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the growth rate and filling uniformity at the film formation of silicon carbide are optimized. 3. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the amount of the added additive gas is adjusted to control the distribution of growth rate at the film formation of silicon carbide with respect to the position in the reaction furnace. 4. The method of manufacturing a heat-resistant composite material according to claim 3 , wherein the distribution of growth rate is optimized to be uniform. 5. The method of manufacturing a heat-resistant composite material according to claim 3 , wherein the raw material gas is supplied through a plurality of positions located from upstream to downstream in the reaction furnace. 6. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the raw material gas includes at least one of methyltrichlorosilane, dimethyldichlorosilane, and trimethylchlorosilane. 7. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the carrier gas includes at least one of hydrogen, nitrogen, helium, and argon. 8. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the raw material gas is methyltrichlorosilane and a flow rate of acetylene relative to the flow rate of methyltrichlorosilane does not exceed 4.9×10 −1 times the flow rate of methyltrichlorosilane. 9. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the additive gas has an etching operation. 10. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the base material includes at least one of a preform of fibers, a substrate provided with a trench, and a porous substrate. 11. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the reaction furnace is a hot-wall furnace. 12. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the hydrocarbon gas is acetylene or methane, and using the flow rate of the raw material gas as a reference, a flow rate of acetylene relative to the flow rate of the raw material gas is 0.13 or more times the flow rate of the raw material gas, or a flow rate of methane relative to the flow rate of the raw material gas is 0.18 or more times the flow rate of the raw material gas. 13. The method of manufacturing a heat-resistant composite material according to claim 12 , wherein the raw material gas includes methyltrichlorosilane. 14. The method of manufacturing a heat-resistant composite material according to claim 1 , wherein the raw material gas includes methyltrichlorosilane.

Assignees

Inventors

Classifications

  • Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

  • characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber · CPC title

  • C23C16/325Primary

    Silicon carbide · CPC title

  • Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates · CPC title

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What does patent US9822445B2 cover?
By using chemical vapor deposition or chemical vapor infiltration, silicon carbide is deposited on a preform 100 accommodated in a reaction furnace 11 for film formation, and the amount of additive gas added to raw material gas and carrier gas to be supplied to the reactive furnace 11 is used to control the growth rate and filling uniformity at film formation of silicon carbide. When the …
Who is the assignee on this patent?
Ihi Corp, Univ Tokyo
What technology area does this patent fall under?
Primary CPC classification C23C16/325. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).