Laser machining method and laser machining device

Patent metadata

Field	Value
Publication number	US-9821408-B2
Application number	US-201214344731-A
Country	US
Kind code	B2
Filing date	Sep 13, 2012
Priority date	Sep 16, 2011
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

Laser light L is converged at an object to be processed 1 , so as to form a modified region 7 including a modified spot S in the object 1 . At this time, the laser light L is converged at a front face 3 of the object 1 while an aberration of the laser light L is corrected such as to locate a converging point of the laser light L near the front face 3 serving as a laser light entrance surface, so as to form a second modified spot S 2 exposed at the front face 3 in the object 1.

First claim

The invention claimed is:

1. A laser processing method for forming a modified region including an exposed indentation in a laser light incident surface of an object to be processed by converging a laser light outside of the laser light incident surface of the object, the method comprising:
loading an aberration correction pattern for display by a spatial light modulator;
displaying the aberration correction pattern by the spatial light modulator;
directing laser light toward the spatial light modulator;
modulating the laser light according to the displayed aberration correction pattern; and
converging the modulated laser light with a converging point of the modulated laser light being located outside of the laser light incident surface of the object, thereby forming an exposed indentation in the laser light incident surface of the object;
wherein:
(i) the aberration correction pattern displayed by the spatial light modulator is a pattern that is configured to correct an aberration that would cause the laser light to be converged inside the laser light incident surface of the object, at a position below the laser light incident surface of the object, if the laser light were not modulated according to the displayed aberration correction pattern; and
(ii) a condenser lens converges the laser light that has been modulated by the displayed aberration correction pattern with the converging point of the modulated laser light being located outside of the laser light incident surface of the object, thereby forming the exposed indentation in the laser light incident surface of the object.

2. A laser processing method according to claim 1 , wherein the object is formed from quartz; and
wherein the position below the laser light incident surface of the object is a position located 1 to 2 μm inside of the laser light incident surface in the object.

3. A laser processing method according to claim 1 , further comprising forming a plurality of exposed indentations in the laser light incident surface of the object by performing at least the converging step multiple times along a cutting line, wherein the forming of the exposed indentations involves relatively moving the modulated laser light along the cutting line while irradiating the object with the modulated laser light.

4. A laser processing method according to claim 3 , further comprising a cutting step of cutting the object along the cutting line using the modified region as a cutting start point.

5. A laser processing device for forming a modified region including exposed indentation in a laser light incident surface of an object to be processed by converging a laser light outside of the laser light incident surface of the object, the device comprising:
a laser light source for oscillating the laser light in a pulsating manner;
a spatial light modulator for displaying an aberration correction pattern loaded onto the spatial light modulator and modulating the oscillated laser light according to the displayed aberration correction pattern;
a condenser optical system for converging the modulated laser light outside of the laser light incident surface of the object while the object is supported on a support table; and
a control unit for controlling at least the laser light source and the spatial light modulator, wherein the control unit executes a process of forming an exposed indentation in the laser light incident surface of the object by converging the modulated laser light outside of the laser light incident surface of the object;
wherein:
(i) the aberration correction pattern displayed by the spatial light modulator is a pattern that is configured to correct an aberration that would cause the laser light to be converged inside the laser light incident surface of the object, at a position below the laser light incident surface of the object, if the laser light were not modulated according to the displayed aberration correction pattern; and
(ii) the condenser optical system comprises a condenser lens that converges the laser light that has been modulated by the displayed aberration correction pattern with the converging point of the modulated laser light being located outside of the laser light incident surface of the object, thereby forming the exposed indentation in the laser light incident surface of the object.

6. A laser processing device according to claim 5 , wherein the process executed by the control unit comprises forming a plurality of exposed indentations in the laser light incident surface of the object by performing at least the converging multiple times along a cutting line, wherein the forming of the exposed indentations involves relatively moving the modulated laser light along the cutting line while irradiating the object with the modulated laser light.

7. A laser processing device according to claim 6 , wherein the process executed by the control unit comprises a cutting step of cutting the object along the cutting line using the modified region as a cutting start point.

Assignees

• Kawaguchi Daisuke
• Hamamatsu Photonics Kk

Inventors

• Kawaguchi Daisuke

Classifications

• B23K2103/56

  being semiconducting · CPC title

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K26/08

  Devices involving relative movement between laser beam and workpiece · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• B23K26/0665 Primary

  by beam condensation on the workpiece, e.g. for focusing · CPC title