Laser machining apparatus that monitors material thickness and type by reflected light intensity

US9463529B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9463529-B2
Application numberUS-201213877762-A
CountryUS
Kind codeB2
Filing dateMay 11, 2012
Priority dateJul 28, 2011
Publication dateOct 11, 2016
Grant dateOct 11, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The laser machining apparatus includes a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber, a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber, a reflected light monitoring unit that detects a reflected light intensity of the reflected light sent from the transmission fiber, and a control device that controls the laser oscillator and the machining head, in which the control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition or not in laser machining on the basis of the reflected light intensity.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laser machining apparatus comprising: a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber; a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber; a reflected-light-intensity detecting unit that detects a reflected light intensity of the reflected light sent from the transmission fiber; and a control device that controls the laser oscillator and the machining head, wherein the control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition in laser machining or not on a basis of the reflected light intensity, wherein the machining condition is read from a machining program that includes a machining position in a product region in the machining object and the machining condition, the determining unit compares a measurement time measured from when the piercing is started to when the reflected light intensity decreases to a predetermined value with a first specified range relating to a measurement time stored in advance, and determines whether the machining object has a thickness corresponding to the machining condition on a basis of a comparison result, and in response to determining that the machining object has a thickness different from a thickness corresponding to the machining condition, the determining unit causes a determination result output unit to output an abnormal determination result relating to thickness. 2. The laser machining apparatus according to claim 1 , wherein the reflected-light-intensity detecting unit detects the reflected light intensity when piercing that is a boring operation to the machining object is performed, and the determining unit determines whether the machining object corresponds to the machining condition on a basis of a reflected light intensity detected when the piercing is performed. 3. The laser machining apparatus according to claim 1 , wherein the determining unit determines whether the machining object corresponds to a machining condition in laser machining in a product region of the machining object or not on a basis of the reflected light intensity. 4. The laser machining apparatus according to claim 3 , wherein the determining unit further extracts a non-product region from the machining object, compares a measurement time measured from when the piercing is started in the non-product region to when the reflected light intensity decreases to the predetermined value, and determines whether the machining object has a thickness corresponding to the machining condition in the product region of the machining object. 5. A laser machining apparatus comprising: a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber; a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber; a reflected-light-intensity detecting unit that detects a reflected light intensity of the reflected light sent from the transmission fiber; and a control device that controls the laser oscillator and the machining head, wherein the control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition in laser machining or not on a basis of the reflected light intensity, wherein the machining condition is read from a machining program that includes a machining position in a product region in the machining object and the machining condition, the determining unit compares a reflected light intensity detected at a time when the piercing is started with a second specified range relating to a reflected light intensity stored in advance, and determines whether the machining object is made of a material corresponding to the machining condition or not on a basis of a comparison result, and in response to determining that the machining object is made of a material different from a material corresponding to the machining condition, the determining unit causes a determination result output unit to output an abnormal determination result relating to material. 6. The laser machining apparatus according to claim 5 , wherein the reflected-light-intensity detecting unit detects the reflected light intensity when piercing that is a boring operation to the machining object is performed, and the determining unit determines whether the machining object corresponds to the machining condition on a basis of a reflected light intensity detected when the piercing is performed. 7. A laser machining control device comprising: an input unit to which reflected light intensity is input when the reflected light intensity of reflected light sent via a machining head and a transmission fiber is detected in a case where the machining head emits laser light, which is emitted from a laser oscillator and is transmitted through the transmission fiber, vertically to a main surface of the machining object and the reflected light is reflected coaxially with the laser light by the machining object; a first storing unit that stores a specified range relating to the reflected light intensity; a second storing unit that stores a machining program that includes a machining position in a product region in the machining object and a machining condition used when laser machining is started; a first control unit that controls the laser oscillator and the machining head by using the machining program; and a determining unit that determines whether the machining object corresponds to the machining condition or not on a basis of a comparison result between a reflected light intensity that is input to the input unit when the machining object is irradiated with laser light under the machining condition and a specified range stored in the storing unit, and the laser machining control device further comprises a second control unit that controls the laser oscillator and the machining head such that test emission of the laser light is performed to a non-product region other than the product region in the machining object, wherein the second control unit sets a test position, to which test emission of the laser light is performed, to any position in the non-product region on a basis of the machining position which is read from the machining program and controls the laser oscillator and the machining head such that the test emission of the laser light is performed to the test position under the machining condition, the determining unit determines whether the machining object corresponds to the machining condition which is read from the machining program or not by using a reflected light intensity at the test position, and causes a determination result output unit to output an abnormal determination result in response to determining that the machining object does not correspond to the machining condition, and the first control unit starts laser machining to the machining object by using the machining program when it is determined that the machining object corresponds to the machining condition. 8. The laser machining control device according to claim 7 , wherein the determining unit determines whether the machining object corresponds to the machining condition or not on a basis of a reflected light intensity detected when piercing that is a boring operation t

Assignees

Inventors

Classifications

  • by beam condensation on the workpiece, e.g. for focusing · CPC title

  • using optical means · CPC title

  • B23K26/38Primary

    by boring or cutting · CPC title

  • Observing, e.g. monitoring, the workpiece · CPC title

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Frequently asked questions

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What does patent US9463529B2 cover?
The laser machining apparatus includes a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber, a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmissio…
Who is the assignee on this patent?
Miyamoto Naoki, Kumamoto Kenji, Nishida Satoshi, and 4 more
What technology area does this patent fall under?
Primary CPC classification B23K26/0665. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 11 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).