Chip-on-film package and device assembly including the same

Patent metadata

Field	Value
Publication number	US-9818732-B2
Application number	US-201514867806-A
Country	US
Kind code	B2
Filing date	Sep 28, 2015
Priority date	May 3, 2012
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

First claim

What is claimed is:

1. A device assembly comprising:
a film package including,
a film substrate having a first surface and a second surface, the first surface being opposite to the second surface,
a first wire on the first surface of the film substrate, the first wire including a first portion located at one end of the film substrate and a second portion spaced apart from the first portion to expose a portion of the film substrate,
a second wire on the second surface of the film substrate,
a through-wire penetrating the film substrate, the through-wire connecting the first portion of the first wire to the second wire, and
a semiconductor chip on the second surface of the film substrate;

a panel substrate on the first surface of the film substrate, the panel substrate connected to the first portion of the first wire; and
a display panel on the panel substrate,
wherein the first portion of the first wire is on the panel substrate.

2. The device assembly of claim 1 , wherein
the semiconductor chip is electrically connected to the second wire.

3. The device assembly of claim 1 , further comprising:
a controlling part on the second surface of the film substrate and connected to another end of the film package,
wherein the semiconductor chip and the controlling part are electrically connected to each other through the second wire.

4. The device assembly of claim 3 , wherein the controlling part includes at least one of a circuit substrate and an electric component electrically connected to the circuit substrate,
wherein the circuit substrate includes a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

5. The device assembly of claim 1 , wherein at least one of the panel substrate and the film substrate has flexibility.

6. The device assembly of claim 1 , wherein the display panel includes an organic light emitting device or a liquid crystal panel.

7. The device assembly of claim 1 , further comprising:
a touch panel on the display panel; and
a touch panel driver connected to one end of the touch panel.

8. A device assembly comprising:
a film substrate having a first surface and a second surface, the first surface being opposite to the second surface;
a first wire on the first surface of the film substrate, the first wire including a first portion located at one end of the film substrate and a second portion spaced apart from the first portion to expose a portion of the film substrate;
a second wire on the second surface of the film substrate;
a through-wire penetrating the film substrate, the through-wire connecting the first portion of the first wire to the second wire;
a display panel on the first wire of the film substrate;
a semiconductor chip on the second wire of the film substrate; and
an electric component on the second wire of the film substrate,
wherein the first portion of the first wire is on the display panel.

9. The device assembly of claim 8 , wherein the display panel and the semiconductor chip are electrically connected to each other.

10. The device assembly of claim 8 , wherein the display panel is electrically connected to the first wire, and the semiconductor chip is electrically connected to the second wire.

11. The device assembly of claim 8 , wherein the semiconductor chip and the electric component are electrically connected to each other through the second wire.

12. The device assembly of claim 8 , further comprising:
a panel substrate between the display panel and the first surface of the film substrate,
wherein the panel substrate is connected to the first portion of the first wire.

13. The device assembly of claim 8 , wherein the film substrate has flexibility.

Assignees

• Jung Jae-Min
• Han Sang-Uk
• Lee Kwanjai
• Cho Kyongsoon
• Ha Jeong-Kyu
• Samsung Electronics Co Ltd

Inventors

• Jung Jae-Min
• Han Sang-Uk
• Lee Kwanjai
• Cho Kyongsoon
• Ha Jeong-Kyu

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/688 Primary

  Flexible insulating substrates · CPC title

• H10W70/60 Primary

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H01L2924/0002

  Electricity · mapped topic