Chip-on-film package and device assembly including the same
US-9818732-B2 · Nov 14, 2017 · US
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Jung Jae-Min patents
Jung Jae-Min holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Aug 18, 2015 |
| Latest publication | Nov 14, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Tape wiring substrate and chip-on-film package including the same
US-9113545-B2 · Aug 18, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Chip-on-film package and device assembly including the same
US-9818732-B2 · Nov 14, 2017 · US
Tape wiring substrate and chip-on-film package including the same
US-9113545-B2 · Aug 18, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H05K1/189 | 1 |
| H05K1/028 | 1 |
| H05K2201/10128 | 1 |
| H05K3/323 | 1 |
| H05K1/147 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |
| Physics | 1 |