Method of manufacturing EUV photo masks
US-12085843-B2 · Sep 10, 2024 · US
US9817306B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9817306-B2 |
| Application number | US-201514862334-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2015 |
| Priority date | Sep 24, 2014 |
| Publication date | Nov 14, 2017 |
| Grant date | Nov 14, 2017 |
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Official abstract text for this publication.
The present invention relates to an EUV pod having marks, which comprises a mask pod and one or more mark disposed on the mask pod. One or more sensor of a processing machine is used for detecting the one or more mark. By including the one or more mark, the surface roughness of one or more region of the mask pod detectable by the one or more sensor can be altered. The one or more sensor emits light to the mask pod, which reflects the light to the one or more sensor. The one or more sensor receives the reflection light from the mask pod and judges if the voltage generated by the reflection light falls within the reflection ranges of the mark. Thereby, whether the one or more sensor corresponds to the one or more make can be confirmed.
Opening claim text (preview).
The invention claimed is: 1. An extreme ultraviolet pod having marks, comprising: a mask pod; and one or more mark, disposed on said mask pod; where said mask pod is configured to be loaded to a processing machine, and one or more sensor of said processing machine is configured to detect said one or more mark; said one or more mark is formed on said mask pod by laser engraving and includes surface roughness, and the surface roughness of said one or more mark ranges between 0 micrometer and 2.00 micrometers; said one or more sensor of said processing machine generates light to illuminate said one or more mark; said one or more mark reflects said light; and the voltage value generated by said reflection light from said one or more mark is produced according to the surface roughness of said one or more mark. 2. The extreme ultraviolet pod having mark of claim 1 , wherein said one or more mark is disposed on one or more region of said mask pod corresponding to one or more sensor of said processing machine. 3. The extreme ultraviolet pod having mark of claim 1 , wherein the voltage values generated by the reflection light from said one or more mark range from 4.80 volts and 5.20 volts. 4. The extreme ultraviolet pod having mark of claim 1 , wherein the 3-sigma standard deviation of the voltage values generated by the reflection light from said one or more mark is controlled within 0.1.
Alignment or registration features, e.g. alignment marks on the mask substrates · CPC title
Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof · CPC title
Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof · CPC title
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