Methods and systems for use in laser machining

Patent metadata

Field	Value
Publication number	US-9815141-B2
Application number	US-201213708288-A
Country	US
Kind code	B2
Filing date	Dec 7, 2012
Priority date	Dec 7, 2011
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

The present embodiments providing methods, systems and apparatuses of protecting a surface during laser machining. In some embodiments, a method of protecting a surface during laser machining comprises: directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; and directing a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage.

First claim

What is claimed is:

1. A method of protecting a surface during laser machining, comprising:
directing a fluid into a cavity of an object being laser machined, wherein the fluid does not have laser absorption properties;
directing a plurality of laser pulses at a wall of the object being laser machined, wherein the plurality of laser pulses are configured to form a hole through the wall such that at least one laser pulse of the plurality of laser pulses passes through the hole and enters the cavity while the fluid is directed into the cavity such that the at least one laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage; and
positioning a protection substrate having the surface within the cavity such that the at least one laser pulse passing through the hole and into the cavity is incident upon the surface of the protection substrate, wherein the protection substrate comprises a grid of apertures wherein the apertures extend through a full thickness of the protection substrate;
wherein the directing the fluid into the cavity comprises directing the fluid to be in contact with the surface of the protection substrate upon which the at least one laser pulse is incident.

2. The method of claim 1 , wherein the positioning the protection substrate comprises:
positioning a fluid redirecting element, coupled with a fluid source, juxtaposed to the protection substrate;
directing the fluid to be in contact with the surface of the protection substrate comprises directing the fluid to directly impinge upon the fluid redirecting element, wherein at least a portion of the fluid is redirected by the redirecting element to impinge upon the surface of the protection substrate at an oblique angle.

3. The method of claim 1 , further comprising:
rotating the protection substrate relative to the direction of the plurality of laser pulses such that multiple laser pulses of the plurality of laser pulses passing through the hole are distributed over the protection substrate.

4. The method of claim 1 , wherein the directing the plurality of laser pulses at the wall of the object comprises:
producing a series of laser pulses; and
controlling which of the laser pulses are directed at the object such that less than all of the series of laser pulses are directed at the object.

5. The method of claim 1 , wherein the positioning the protection substrate having the surface comprises positioning the protection substrate with the surface of the protection substrate positioned at an oblique angle to a direction of the plurality of laser pulses and upon which the at least one laser pulse is incident.

6. The method of claim 1 , wherein the positioning the protection substrate comprises positioning the protection substrate such that the laser pulses of the plurality of laser passing through the hole formed in the wall impinge upon one or more of the apertures upon passing through the hole.

7. The method of claim 1 , wherein the apertures of the grid are each tapered along an axis of each of the apertures.

8. The method of claim 1 wherein the surface of the protection substrate upon which the at least one laser pulse is incident comprises a material that is at least partially reflective.

9. The method of claim 1 , further comprising:
positioning a protection substrate within the cavity of the object such that the at least one laser pulse directed at the wall of the object in performing the laser machining is incident upon the protection substrate when the at least one laser pulse passes through the hole in the object formed through the laser machining and enters the cavity, wherein the at least one laser pulse is inhibited from impinging on a back surface of the object across the cavity from the hole; and
positioning a fluid source relative to the protection substrate;
wherein the directing the fluid into the cavity comprises directing the fluid onto the protection substrate.

10. The method of claim 9 , wherein the fluid is substantially free of laser-barrier properties upon delivery into the cavity by the fluid source at wavelengths of the plurality of laser pulses.

11. The method of claim 10 , wherein the fluid comprises one or more of water, super cooled water, alcohol, and liquid nitrogen.

12. The method of claim 9 , wherein the positioning the protection substrate having the surface comprises positioning the protection substrate proximate an exit aperture of the fluid source such that the fluid is directed directly at the protection substrate and directly impacts the surface of the protection substrate on which the at least one laser pulse is incident.

13. The method of claim 9 , wherein the fluid source comprises a fluid delivery conduit and a redirecting element positioned relative to an end of the fluid delivery conduit, wherein the positioning the fluid source comprises positioning the redirecting element juxtaposed to the protection substrate; and
wherein the directing the fluid into the cavity comprises directing fluid to contact the redirecting element and redirecting, through contact with the redirecting element, at least a portion of the fluid to contact the surface of the protection substrate upon which the at least one laser pulse is incident.

14. The method of claim 13 , wherein the positioning the protection substrate comprises positioning the protection substrate through one or more registers secured about at least the fluid delivery conduit such that the at least one laser pulse impinges upon the protection substrate.

15. The method of claim 13 , further comprising:
positioning an internal gas assist jet source fixed about and coaxially aligned with at least a portion of a length of the fluid delivery conduit proximate the redirecting element; and
releasing a flow of gas through the internal gas assist jet source relative to the hole in the object being formed through the laser machining.

16. A method of protecting a surface during laser machining, comprising:
directing a fluid into a cavity of an object being laser machined, wherein the fluid does not have laser absorption properties;
directing a plurality of laser pulses at a wall of the object being laser machined, wherein the plurality of laser pulses are configured to form a hole through the wall such that at least one laser pulse of the plurality of laser pulses passes through the hole and enters the cavity while the fluid is directed into the cavity such that the at least one laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage;
configuring a laser source relative to the object being laser machined;
controlling the laser source to produce a series of laser pulses while implementing the directing the fluid into the cavity;
controlling which of the laser pulses of the series of laser pulses are directed at the object such that less than all of the laser pulses of the series of laser pulses are directed at the object wherein a timing between a plurality of pulses that are directed at the object provide protection of a backwall of the object from damage that would otherwise be caused by one or more of the laser pulses directed at the object and passing through the hole; and
positioning a protection substrate having the surface within the cavity such that the at least one laser pulse passing through the hole and into the cavity is incident upon the surface of the protection substrate, wherein the protection substrate comprises a grid of apertures wherein the apertures of the grid of apertures extend through a full thickness of the protection substrate;
wherein

Assignees

• General Atomics

Inventors

• Forsman Andrew C
• Johnson Billy L
• Lundgren Erik H
• Bertch Timothy C
• Moeller Charles P
• Carmichael James A

Classifications

• B23K26/18 Primary

  using absorbing layers on the workpiece, e.g. for marking or protecting purposes · CPC title

• B23K26/702

  Auxiliary equipment · CPC title

• B23K26/389 Primary

  of fluid openings, e.g. nozzles, jets · CPC title

• B23K26/009 Primary

  using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661) · CPC title

• B23K26/042

  Automatically aligning the laser beam · CPC title