Roll to roll wafer backside particle and contamination removal

Patent metadata

Field	Value
Publication number	US-9815091-B2
Application number	US-201414476398-A
Country	US
Kind code	B2
Filing date	Sep 3, 2014
Priority date	Jun 19, 2014
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Particulate cleaning assemblies and methods for cleaning are disclosed. In one example, a device for removing particles from a backside surface of a substrate is described. The device includes a chamber body with a substrate chucking device, a particulate cleaning article positioned over the substrate supporting surface, an optical sensing device positioned under the particulate cleaning article and a substrate positioning device separates the particulate cleaning article and a substrate. In another example, a method for removing particles from a substrate is disclosed. The method includes positioning a substrate with a processing surface and a supporting surface in a process chamber. At least a portion of the substrate can be chucked to a substrate chucking device, the substrate chucking device having a substrate supporting surface with a particulate cleaning article positioned thereon. The substrate is then separated from the particulate cleaning article leaving particles behind.

First claim

The invention claimed is:

1. A device for removing particles from the backside of a substrate, comprising:
a substrate chucking device having a substrate supporting surface;
a supply assembly and a take up assembly configured to receive a particulate cleaning article, having a path for the particulate cleaning article over and in contact with the substrate supporting surface, the supply assembly and the take up assembly being positioned on opposite ends of the substrate chucking device, and below a plane of the substrate chucking device; and
a substrate positioning device configured to separate the particulate cleaning article and a substrate.

2. The device of claim 1 , wherein the substrate positioning device comprises a plurality of lift pins.

3. The device of claim 2 , wherein the particulate cleaning article has a plurality of openings configured to align with the lift pins.

4. The device of claim 1 , wherein the substrate chucking device comprises an electrode configured to provide an electrostatic force.

5. The device of claim 1 , wherein the particulate cleaning article is a web.

6. The device of claim 1 , further comprising an optical sensing device, wherein the optical sensing device is a laser.

7. The device of claim 6 , wherein the optical sensing device determines both a position and a saturation of the particulate cleaning article.

8. The device of claim 1 , wherein the particulate cleaning article is a linear adhesive film, and wherein the linear adhesive film is non-adhesive to the substrate supporting surface.

9. The device of claim 1 , wherein the substrate positioning device comprises a robotic arm.

10. A device for removing particles from a substrate, comprising:
a substrate chucking device having a substrate supporting surface and a plurality of lift pins;
a supply assembly and a take up assembly configured to receive an advanceable particulate cleaning article, the supply assembly and the take up assembly being positioned on opposite ends of the substrate chucking device, and below a plane of the substrate chucking device;
the advanceable particulate cleaning article positioned over the substrate supporting surface, the particulate cleaning article having a plurality of lift pin openings formed therein; and
an optical sensing device configured to provide a metric for positioning the particulate cleaning article on the substrate chucking device.

11. The device of claim 10 , wherein the optical sensing device determines both the position and the saturation of the particulate cleaning article.

12. The device of claim 10 , wherein the substrate chucking device comprises an electrode configured to provide an electrostatic force.

13. The device of claim 10 , wherein the particulate cleaning article includes an adhesive layer disposed on a side of the particulate cleaning article facing away from the substrate supporting surface.

14. The device of claim 10 , further comprising a robotic arm configured to position the substrate on the particulate cleaning article.

15. The device of claim 10 , wherein the particulate cleaning article is a web.

16. A device for removing particles from the backside of a substrate, comprising:
a substrate chucking device having a substrate supporting surface;
a supply assembly and a take up assembly configured to receive a particulate cleaning article, having a path for the particulate cleaning article over and in contact with the substrate supporting surface, the supply assembly and the take up assembly being positioned on opposite ends of the substrate chucking device, and below a plane of the substrate chucking device; and
a substrate positioning device configured to separate the particulate cleaning article and a substrate, the substrate positioning device having at least one lift pin and the particulate cleaning article having at least one opening configured to align with the at least one lift pin.

17. The device of claim 16 , wherein a plurality of the lift pins extend between opposite ends of the substrate chucking device, such that coverage of the lift pins extends an entire width of the substrate chucking device.

18. The device of claim 16 , wherein the substrate chucking device comprises an electrode configured to provide an electrostatic force.

19. The device of claim 16 , further comprising an optical sensing device, wherein the optical sensing device is a laser.

20. The device of claim 19 , wherein the optical sensing device determines both a position and a saturation of the particulate cleaning article.

Assignees

• Applied Materials Inc

Inventors

• Ngai Christopher S
• Dai Huixiong
• Godet Ludovic
• Yieh Ellie Y

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• B08B6/00

  Cleaning by electrostatic means · CPC title