Surface wetting method

Patent metadata

Field	Value
Publication number	US-9815082-B2
Application number	US-201414775947-A
Country	US
Kind code	B2
Filing date	Mar 14, 2014
Priority date	Mar 15, 2013
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

In a method for forming nanopores, two opposing surfaces of a membrane are exposed to an electrically conducting liquid environment. A nanopore nucleation voltage pulse, having a first nucleation pulse amplitude and duration, is applied between the two membrane surfaces, through the liquid environment. After applying the nanopore nucleation voltage pulse, the electrical conductance of the membrane is measured and compared to a first prespecified electrical conductance. Then at least one additional nanopore nucleation voltage pulse is applied between the two membrane surfaces, through the liquid environment, if the measured electrical conductance is no greater than the first prespecified electrical conductance.

First claim

We claim:

1. A method for wetting a surface comprising:
disposing a surface to be wetted in a local wetting environment;
flushing the local wetting environment with a flushing gas for a flushing duration that replaces air in the wetting environment with the flushing gas;
preventing air from entering back into the local wetting environment; and
introducing a liquid wetting solution into the local wetting environment while the flushing gas is in the wetting environment, the flushing gas having at least one condition selected from the group consisting of 1) being chemically reactive with the liquid wetting solution to produce a chemical reaction product that is dissolvable in the liquid wetting solution and 2) being dissolvable in the liquid wetting solution.

2. The method of claim 1 wherein disposing the surface to be wetted in a local wetting environment comprises disposing a membrane, having two opposing surfaces to be wetted, in the local wetting environment.

3. The method of claim 1 wherein disposing the surface to be wetted in a local wetting environment comprises disposing a structure, have a surface to be wetted, in a liquid flow cell.

4. The method of claim 3 wherein disposing the structure in a liquid flow cell comprises disposing the structure in a liquid flow cell that contains no liquid.

5. The method of claim 1 wherein flushing the local wetting environment with a flushing gas comprises flowing the flushing gas at a flow pressure that flushes all air from the local wetting environment.

6. The method of claim 1 wherein the local wetting environment is a vessel.

7. The method of claim 1 wherein the local wetting environment is a vessel having at least one inlet port, and wherein preventing air from entering hack into the local wetting environment comprises submerging the vessel in a liquid while flowing the flushing gas into the vessel.

8. The method of claim 1 wherein introducing a liquid wetting solution into the local wetting environment comprises flowing the liquid wetting solution into the local wetting environment while flowing the flushing gas into the local wetting environment.

9. The method of claim 1 wherein the flushing gas comprises carbon dioxide.

10. The method of claim 1 wherein the flushing gas comprises chlorine gas.

11. The method of claim 1 wherein the flushing gas is selected from the group consisting of carbon dioxide gas, ammonia gas, and chlorine gas, and wherein the wetting solution is a pH basic liquid.

12. The method of claim 1 wherein the flushing gas is chemically reactive with the liquid wetting solution to produce a chemical reaction product comprising electrically charged ions that are dissolvable in the liquid wetting solution.

13. The method of claim 1 wherein the flushing gas is selected from the group consisting of carbon dioxide and chlorine gas, and wherein the wetting solution is selected from the group consisting of KOH, NaOH, and NH 4 OH.

14. The method of claim 1 wherein the surface to be wetted comprises a nanopore surface through a thickness of a membrane.

15. The method of claim 1 wherein the surface to be wetted comprises opposing surfaces of an atomically-thin membrane having no more than 10 atomic layers in thickness.

16. The method of claim 1 wherein surface to be wetted comprises a graphene surface.

17. The method of claim 1 wherein introducing a liquid wetting solution into the local wetting environment comprises filling the local wetting environment with the liquid wetting solution.

18. The method of claim 1 further comprising replacing the wetting solution in the local wetting environment with a selected liquid solution whereby the surface to be wetted is wetted by the selected liquid solution as the selected liquid solution replaces the wetting solution.

19. The method of claim 18 wherein the selected liquid solution replacing the wetting solution is an electrolytic solution.

20. The method of claim 19 wherein the electrolytic solution includes polymer molecules.

Assignees

• Harvard College

Inventors

• Golovchenko Jene A
• Lu Bo
• Kuan Aaron T

Classifications

• C25F3/00

  Electrolytic etching or polishing · CPC title

• B01D2323/35

  Use of magnetic or electrical fields · CPC title

• B01D67/0034

  by micromachining techniques, e.g. using masking and etching steps, photolithography · CPC title

• C25F3/14 Primary

  locally · CPC title

• B01D69/02

  characterised by their properties · CPC title