Surface treatment method and surface treatment device

Patent metadata

Field	Value
Publication number	US-2016160378-A1
Application number	US-201514955791-A
Country	US
Kind code	A1
Filing date	Dec 1, 2015
Priority date	Dec 3, 2014
Publication date	Jun 9, 2016
Grant date	—

Abstract

A surface treatment method includes: roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of a masking plate through the through hole, in a state where: a first surface of the solid electrolyte film is arranged directly on the surface of the substrate; and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate.

First claim

What is claimed is:

1 . A surface treatment method comprising
roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of the masking plate through the through hole, in a state where a first surface of the solid electrolyte film is arranged directly on the surface of the substrate, and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate.

2 . The surface treatment method according to claim 1 , wherein
the surface of the substrate is made from metal, and the roughening includes applying voltage between the substrate serving as a positive electrode and a conductive member serving as a negative electrode in a state where the conductive member is provided on the second surface of the masking plate.

3 . The surface treatment method according to claim 2 , wherein
the solvent is supplied from a liquid accommodating chamber of a liquid supplying part, and the conductive member is arranged on the second surface of the masking plate through the liquid accommodating chamber.

4 . A method for forming a metallic film, comprising:
roughening a surface region of the substrate by the surface treatment method according to claim 2 ; after the roughening, allowing metal ion to penetrate the solid electrolyte film by supplying a metallic solution containing the metal ion of the metallic film to the solid electrolyte film through the through hole; and forming a metallic film on the surface region by depositing the metal ion of the metallic solution on the roughened surface region by applying voltage between the substrate serving as a negative electrode and the conductive member serving as a positive electrode.

5 . A surface treatment device for partially roughening a surface of a substrate by using a solvent that dissolves the surface of the substrate, comprising:
a solid electrolyte film that has a first surface and a second surface, and allows the solvent to penetrate the solid electrolyte film, the first surface of the solid electrolyte film being to be brought into direct contact with the surface of the substrate; a masking plate having a through hole corresponding to a surface region of the substrate, a first surface, and a second surface, the first surface of the masking plate being arranged directly on the second surface of the solid electrolyte film, the surface region being to be roughened; and a liquid supplying part that is configured to supply the solvent to the first surface of the solid electrolyte film from the second surface of the masking plate through the through hole.

6 . The surface treatment device according to claim 5 , wherein
the surface treatment device is configured to partially roughen a metallic surface of the substrate, the surface treatment device further comprising: a conductive member provided on the second surface of the masking plate; and a power supply configured to apply voltage between the substrate serving as a positive electrode and the conductive member serving as a negative electrode.

7 . The surface treatment device according to claim 6 , wherein
the liquid supplying part includes a liquid accommodating chamber in which the solvent is accommodated, and the conductive member is arranged on the second surface of the masking plate through the liquid accommodating chamber.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki
• Hiraoka Motoki
• Yanagimoto Hiroshi

Classifications

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25F7/00

  Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating · CPC title

• C25D5/022

  using masking means · CPC title

• C25F3/14 Primary

  locally · CPC title