Lithographic apparatus and method of cooling a component in a lithographic apparatus

Patent metadata

Field	Value
Publication number	US-9811007-B2
Application number	US-201213644653-A
Country	US
Kind code	B2
Filing date	Oct 4, 2012
Priority date	Oct 7, 2011
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A lithographic apparatus includes a component and a local cooler to apply a local cooling load to the component. The local cooler has a gas passageway including a flow restriction upstream of the component and configured to direct a flow of gas exiting the flow restriction to cool a surface of the component.

First claim

The invention claimed is:

1. A lithographic apparatus comprising:
a component;
a local cooler to apply a local cooling load to the component, the local cooler comprising:
a gas passageway including a flow restriction upstream of the component and configured to direct a flow of gas exiting the flow restriction to cool a surface of the component, wherein the gas passageway further comprises an outlet downstream of the component; and
a gas handling system connected to the outlet and configured to use gas from the passageway for a purpose primarily other than as a coolant, wherein the gas handling system is configured to use the gas from the passageway to purge a space of unwanted gas or contaminants or to form a contactless seal between two surfaces or to dry a wet surface.

2. The lithographic apparatus of claim 1 , wherein the local cooler further comprises a cooling controller adapted to control a pressure drop of gas over the flow restriction and thereby the magnitude of the local cooling load on the component.

3. The lithographic apparatus of claim 2 , wherein the flow restriction is a variable flow restriction and the cooling controller is configured to control the size of the flow restriction and thereby the magnitude of the pressure drop.

4. The lithographic apparatus of claim 2 , further comprising a pressure regulator configured to regulate gas pressure in the passageway upstream of the flow restriction.

5. The lithographic apparatus of claim 4 , wherein the cooling controller is configured to vary a pressure setting of the pressure regulator and thereby the pressure drop over the flow restriction.

6. The lithographic apparatus of claim 2 , further comprising a temperature sensor to sense a temperature of the component and wherein the cooling controller is configured to adjust the pressure drop in a feedback manner based on the temperature sensed by the temperature sensor.

7. The lithographic apparatus of claim 2 , further comprising a downstream temperature sensor to measure a temperature of gas in the passageway downstream of the component.

8. The lithographic apparatus of claim 7 , wherein the cooling controller is configured to adjust the pressure drop based on the temperature measured by the downstream temperature sensor.

9. The lithographic apparatus of claim 1 , further comprising a heat exchanger configured to maintain gas in the passageway upstream of the flow restriction at a certain temperature.

10. The lithographic apparatus of claim 1 , wherein the component is part of a substrate table configured to support a substrate, or a projection system, or a projection system top plate.

11. A lithographic apparatus comprising:
a component;
a local cooler to apply a local cooling load to the component, the local cooler comprising:
a gas passageway including a flow restriction upstream of the component and configured to direct a flow of gas exiting the flow restriction to cool a surface of the component;
a pressure regulator configured to regulate gas pressure of the flow of gas in the passageway upstream of the flow restriction;
a mass flow controller, separate from the pressure regulator, configured to control the flow rate of the flow of gas in the passageway upstream of the flow restriction; and
a cooling controller adapted to control a pressure drop of gas over the flow restriction and thereby the magnitude of the local cooling load on the component.

12. The lithographic apparatus of claim 11 , wherein the mass flow controller is configured to maintain the flow of gas at a substantially constant magnitude.

13. The lithographic apparatus of claim 11 , wherein the cooling controller is configured to control the mass flow controller to adjust the magnitude of the flow of gas and thereby the magnitude of the pressure drop.

14. The lithographic apparatus of claim 11 , comprising a pressure sensor configured to measure a pressure of gas in the passageway upstream of the flow restriction.

15. The lithographic apparatus of claim 14 , further comprising a limit controller configured to limit the pressure of gas in the passageway upstream of the flow restriction when the pressure measured by the pressure sensor exceeds a certain value.

16. A lithographic apparatus comprising:
a component;
a local cooler to apply a local cooling load to the component, the local cooler comprising:
a gas passageway including first and second flow restrictions each configured to cause sudden expansion of gas and configured to direct a flow of gas exiting the first and second flow restrictions to cool a surface of the component, wherein the first flow restriction is fluidly connected to, and upstream of, the second flow restriction such that a same flow of gas passing through the first flow restriction passes through the second flow restriction.

Assignees

• Van Boxtel Frank Johannes Jacobus
• Van Der Net Antonius Johannus
• Van Den Heuvel Leonarda Hendrika
• Asml Netherlands Bv

Inventors

• Van Boxtel Frank Johannes Jacobus
• Van Der Net Antonius Johannus
• Van Den Heuvel Leonarda Hendrika

Classifications

• G03F7/70991

  Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum · CPC title

• G03F7/70891

  Temperature · CPC title

• G03F7/70875 Primary

  Temperature, e.g. temperature control of masks or workpieces via control of stage temperature · CPC title

• G03B27/523

  for full time exposure · CPC title

• H10P76/204 Primary

  of organic photoresist masks · CPC title