Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire

Patent metadata

Field	Value
Publication number	US-9809872-B2
Application number	US-75655110-A
Country	US
Kind code	B2
Filing date	Apr 8, 2010
Priority date	Apr 17, 2009
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance of pure copper and inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO 2 , TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO 2 , TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.

First claim

What is claimed is:

1. A dilute copper alloy material, consisting of:
based on a total mass of the dilute copper alloy material, 3 to 12 mass ppm of sulfur, 7 to 30 mass ppm of oxygen, 4 to 40 mass ppm of titanium, and
a balance consisting of pure copper and inevitable impurity,
wherein a conductivity is not less than 102% International Annealed Copper Standard (IACS) and a softening temperature is 130° C. to 148° C., and
wherein a part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO 2 , TiS and Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution,
wherein the compound or the aggregate of TiO, TiO 2 , TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and
not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.

2. A dilute copper alloy wire, comprising:
the dilute copper alloy material according to claim 1 ;
a conductivity not less than 102% IACS; and
a softening temperature of 130° C. to 148° C. when a diameter thereof is 2.6 mm.

3. A dilute copper alloy wire, comprising:
a dilute copper alloy material consisting of, based on a total mass of said dilute copper alloy material, 3 to 12 mass ppm of sulfur, 7 to 30 mass ppm of oxygen, 4 to 37 mass ppm of titanium, and a balance consisting of pure copper and inevitable impurity;
a conductivity not less than 102% International Annealed Copper Standard (IACS); and
a softening temperature of 130° C. to 148° C. when a diameter thereof is 2.6 mm,
wherein a part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO 2 , TiS and Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution,
wherein the compound or the aggregate of TiO, TiO 2 , TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and
not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.

4. A dilute copper alloy wire, comprising:
a dilute copper alloy material consisting of, based on a total mass of said dilute copper alloy material, 3 to 12 mass ppm of sulfur, 7 to 30 mass ppm of oxygen, 4 to 25 mass ppm of titanium, and a balance consisting of pure copper and inevitable impurity;
a conductivity not less than 102% International Annealed Copper Standard (IACS); and
a softening temperature of 130° C. to 148° C. when a diameter thereof is 2.6 mm,
wherein a part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO 2 , TiS and Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution,
wherein the compound or the aggregate of TiO, TiO 2 , TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and
not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.

5. The dilute copper alloy wire according to claim 2 , further comprising a plating layer formed on a surface of the dilute copper alloy wire.

6. A dilute copper alloy twisted wire, comprising:
a plurality of the dilute copper alloy wires according to claim 2 twisted together.

7. A cable, comprising:
the dilute copper alloy wire according to claim 2 , and
an insulating layer formed on the dilute copper alloy wire.

8. A coaxial cable, comprising:
a central conductor comprising a plurality of the dilute copper alloy wires according to claim 2 twisted together;
an insulation cover on an outer periphery of the central conductor;
an outer conductor comprising copper or copper alloy on an outer periphery of the insulation cover; and
a jacket layer on an outer periphery of the outer conductor.

9. A composite cable, comprising:
a plurality of the cables according to claim 7 arranged in a shield layer; and
a sheath on an outer periphery of the shield layer.

10. A method of manufacturing a dilute copper alloy wire, comprising:
forming molten metal by melting the dilute copper alloy material according to claim 1 by SCR continuous casting and rolling at a casting temperature of not less than 1100° C. and not more than 1320° C.;
making a wire rod at a working ratio of 90% (corresponding to 30 mm in diameter) to 99.8% (corresponding to 5 mm in diameter); and
making a dilute copper alloy wire by hot-rolling the wire rod.

11. The method according to claim 10 , wherein said hot-rolling is conducted such that temperature is not more than 880° C. at an initial roll and not less than 550° C. at a final roll.

12. The method according to claim 10 , wherein copper as a base of the dilute copper alloy material is molten in a shaft furnace, and is subsequently cast and rolled under a reducing system comprising a reductive gas atmosphere shield while controlling concentrations of sulfur, titanium and oxygen in the dilute copper alloy material.

13. A method of manufacturing a dilute copper alloy member, comprising:
forming a wire rod from the dilute copper alloy material according to claim 1 by twin-roll continuous casting and rolling and Properzi type continuous casting and rolling at a casting temperature of not less than 1100° C. nor more than 1320° C.; and
hot-rolling the wire rod, wherein said hot-rolling is conducted such that temperature is not more than 880° C. at an initial roll and not less than 550° C. at a final roll.

14. The method according to claim 13 , wherein copper as a base of the dilute copper alloy member is molten in a shaft furnace, and is subsequently cast and rolled under a reducing system comprising a gutter in a reduced-state and a reductive gas atmosphere shield while controlling concentrations of sulfur, titanium and oxygen in the dilute copper alloy material.

15. A solder-plated composite wire for a solar cell manufactured by using the dilute copper alloy wire according to claim 2 .

16. The dilute copper alloy wire according to claim 5 , wherein the plating layer comprises tin, nickel or silver.

Assignees

• Aoyama Seigi
• Sumi Toru
• Sakai Shuji
• Sato Takahiro
• Abe Hidenori
• Hitachi Metals Ltd

Inventors

• Aoyama Seigi
• Sumi Toru
• Sakai Shuji
• Sato Takahiro
• Abe Hidenori

Classifications

• H01B1/026

  Alloys based on copper · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• B22D21/025

  Casting heavy metals with high melting point, i.e. 1000 - 1600 degrees C, e.g. Co 1490 degrees C, Ni 1450 degrees C, Mn 1240 degrees C, Cu 1083 degrees C · CPC title

• C22C9/00 Primary

  Alloys based on copper · CPC title