Techniques for a module connector design to improve pin connection
US-2024421516-A1 · Dec 19, 2024 · US
Solder alloy
US9808890B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9808890-B2 |
| Application number | US-201314394887-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 17, 2013 |
| Priority date | Apr 18, 2012 |
| Publication date | Nov 7, 2017 |
| Grant date | Nov 7, 2017 |
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- Title
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Abstract
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A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.
First claim
Opening claim text (preview).
The invention claimed is: 1. A solder joint made of a solder alloy having an alloy composition comprising Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass %, Ni of 0.005 through 0.3 mass % and balance of Sn, wherein the solder joint forms a metal junction between the alloy and an Al surface or an Ni surface. 2. The solder joint claimed in claim 1 , wherein mass ratio of Al and Ti in the solder alloy is 0.4≦Al/(Al+Ti)<0.6. 3. The solder joint claimed in claim 1 , wherein the solder joint forms the metal junction between the alloy and the Al surface. 4. The solder joint made of the solder alloy claimed in claim 1 , wherein the solder joint forms the metal junction between the alloy and the Ni surface. 5. A jointing method comprising forming the solder joint of claim 1 . 6. A jointing method comprising forming the solder joint of claim 2 . 7. A jointing method comprising forming the solder joint of claim 3 . 8. A jointing method comprising forming the solder joint of claim 4 .
Assignees
Inventors
Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Alloys based on tin · CPC title
Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) · CPC title
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9808890B2 cover?
- A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K1/0016. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).