Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-9808836-B2
Application number	US-201414316709-A
Country	US
Kind code	B2
Filing date	Jun 26, 2014
Priority date	Jun 28, 2013
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

First claim

What is claimed is:

1. A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface, the substrate processing apparatus comprising:
a scrubber configured to place at least one scrubbing member in sliding contact with the first surface of the substrate to process the first surface, the scrubber having a plurality of deformable elastic members supporting the at least one scrubbing member, the plurality of elastic members having top surfaces, respectively, which are spaced from each other; and
a hydrostatic support structure configured to support the second surface of the substrate via fluid without contacting the substrate.

2. The substrate processing apparatus according to claim 1 , wherein the scrubber has a hard member which is harder than the plurality of elastic members, and the plurality of elastic members are fixed to the hard member.

3. The substrate processing apparatus according to claim 1 , wherein the scrubber has a hard member which is harder than the plurality of elastic members, and the hard member is disposed between the plurality of elastic members and the at least one scrubbing member.

4. The substrate processing apparatus according to claim 1 , wherein the plurality of elastic members comprise a plurality of air bags filled with a gas.

5. The substrate processing apparatus according to claim 1 , wherein the at least one scrubbing member comprises a plurality of scrubbing members, and each one of the plurality of scrubbing members is supported by at least two of the plurality of elastic members.

6. The substrate processing apparatus according to claim 1 , wherein the plurality of elastic members are spaced from each other with a gap larger than a thickness of the plurality of elastic members.

7. The substrate processing apparatus according to claim 1 , wherein the scrubber has at least one hard member which is harder than the plurality of elastic members, and the top surfaces are fixed to the at least one hard member.

8. The substrate processing apparatus according to claim 1 , wherein the scrubber has a holder and the top surfaces are fixed to the holder.

Assignees

• Ebara Corp

Inventors

• Togawa Tetsuji
• Ito Kenya
• Ishii Yu
• Uchiyama Keisuke

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/76

  using mechanical means, e.g. clamps or pinches · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title